Technology, Process and Cost
Zinsight - ZPAK Drive module on cooler
Yole Group reveals the industry’s first deep-dive analysis of Zinsight ZPAK Drive module on cooler for automotive applications
SPR26041Designed for electric and hybrid vehicle applications, the Zinsight ZPAK Drive Power Module on Cooler combines power module integration with thermal management. This report analyzes its physical structure, manufacturing process flow, technology choices, materials, and cost breakdown to provide a clear view of its technical and economic positioning.
- Provide a comprehensive reverse costing study of the leading-edge ZPAK Drive power module.
- Provide exhaustive physical and technology analysis, including optical and scanning electron microscope images with EDX material analysis, from the module’s opened package down to the microscopic level of die design.
- Analyze the packaging innovations and the integration strategy behind this module platform. This includes Zinsight’s innovative technology choices for assembling its dies, as well as the assembly of each power module card to obtain the final module-on-cooler.
- Provide a detailed analysis of the design of dies.
- Provide detailed manufacturing process step-by-step, from die Front-End wafer up to the module Back-End packaging.
- Provide an exhaustive cost analysis: FE wafer cost breakdown, die cost breakdown, packaging cost breakdown, module cost breakdown, and price estimation with a detailed yield model for each process cost sequence: wafer, die and packaging.
Tightening environmental regulations are accelerating vehicle electrification, driving increased adoption of BEVs, PHEVs and HEVs. In this context, Yole Group forecasts the xEV market will reach 69.6 million vehicles by 2031.
Yole Group analyzes the Zinsight ZPAK Drive Power Module on Cooler, a 750 V, 400 A IGBT three-phase-bridge power module aimed at the HEV market. This module integrates a molded power-card architecture with a cooler, combining electrical interconnection, mechanical integration and thermal-management functions within a compact format.
The report delivers a comprehensive reverse-costing study, including teardown, physical analysis, die technology, packaging innovations, manufacturing cost analysis and estimated selling price. It provides valuable intelligence for stakeholders across the electrification supply chain and will be featured in the upcoming Automotive Power Module Packaging Comparison 2026. where it will be benchmarked against competing solutions from other leading manufacturers.
Overview
- Company Profile, Supply Chain, Market
Physical Analysis
- Summary
- Package Analysis
- Package View & Opening
- Package Cross-Section
- Die Analysis
- Die Views & Dimensions, Die Delayering
- Die Cross Section
Manufacturing Process Flow
- Wafer Fab Unit
- Wafer Process Flow Sketches
- Assembly Unit
- Assembly Process Flow
Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- Wafer & Die Costs
- Substrate Assembly Cost
- Packaging Cost
- Module Cost
Selling Price Analysis
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