Power electronics at a strategic turning point – NEPCON 2026 post show report
NEPCON 2026 confirmed that power electronics is entering a new phase of transformation, driven by cost pressure, supply-chain rebalancing, and rapid innovation across bare die devices and device and packaging.
One of the most discussed topics at the show was the rapid decline in SiC wafer and device prices, which is reshaping competitive dynamics for power device manufacturers. This trend is accelerating design choices, sourcing strategies, and investment decisions across the ecosystem.
Milan Rosina
PhD, Principal Analyst, Power Electronics & Battery at Yole Group
We are clearly seeing a shift from pure performance-driven strategies to a more balanced equation between cost, reliability, and supply-chain resilience.
Another key takeaway from NEPCON was the growing importance of understanding the Chinese power electronics supply chain in detail. Knowing who supplies whom has become essential to identifying both competitive threats and emerging business opportunities. At the same time, India is rapidly gaining momentum, with expanding opportunities in power device manufacturing and across a broad range of applications.
From a technology perspective, innovation remains strong. Scientific institutes, IDMs, and packaging players showcased advanced approaches to power module design and materials, including low-inductance architectures, metallized ceramic substrates, compact double-sided modules and high-temperature solutions.
The embedded-die approach stood out as a major focus area for automotive Tier-1s, OEMs, PCB and ceramic substrate suppliers, and OSATs. Intelligent Power Modules (IPMs) continue to gain traction in applications where compactness outweighs the need for the lowest cost.
Supply-chain strategy is also evolving. Dual sourcing is increasingly required, illustrated by the recent Fuji Electric–Bosch partnership to jointly offer mechanically compatible SiC power modules for EVs.
Finally, NEPCON highlighted ongoing innovation at the device and system level, from a 1700 V monolithic SiC IC co-developed by PANJIT Semiconductor and Foxconn, to GaN-based high-frequency converter designs demonstrated by Nagoya University.
NEPCON clearly showed that power electronics is no longer evolving in silos. Devices, packaging, supply chains, and system architectures are now deeply interconnected.
NEPCON clearly showed that power electronics is no longer evolving in silos. Devices, packaging, supply chains, and system architectures are now deeply interconnected.
Milan Rosina PhD, Principal Analyst, Power Electronics & Battery at Yole GroupWe are clearly seeing a shift from pure performance-driven strategies to a more balanced equation between cost, reliability, and supply-chain resilience.
