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WHAT’S IN THE BOX? TV boxes: Google Chromecast 4K, Amazon Fire TV Stick 4K Max and Apple TV 4K at a glance

Based on three recent reports, Yole Group experts present today a technological and cost comparison of TV boxes produced by three major companies: Google, Amazon, and Apple. The analysis also uncovers the different business models these U.S. tech giants have adopted to penetrate this fruitful market.


TV boxes are designed to transform any television into a smart device. According to Yole Intelligence’s Semiconductor Trends in Mobile and Consumer 2024 report, in 2023, 240 million TV sets were produced. Although 90% of them were smart TVs, this leaves a significant market opportunity for TV boxes considering that approximately 50% of TV sets currently in use are not yet smart.

In the TV box processor market, APU providers take the lion’s share with Apple, Qualcomm and Mediatek in the lead. According to Yole Group’s Processor Market Monitor 2024, Amlogic, originally rooted in the smart TV sector, has managed to elbow its way into sixth position and demonstrate impressive growth, with its revenue tripling between 2017 and 2023.

Highlights from Yole SystemPlus Teardown Tracks

The teardowns reveal that the main difference lies in the choice of processor. Google, Amazon, and Apple each opted for different chip designers — Amlogic, Mediatek, and Apple respectively — and technology nodes (12 nm for Google and Amazon, 5 nm for Apple). Apple’s use of such an advanced node could be part of a strategy to leverage its existing A15 processor to speed up time-to-market. The A15’s high computing power also allows Apple to offer a premium TV box that efficiently handles video streaming tasks. The Apple TV 4K therefore has a selling price of $150, which is three times higher than the two competing devices.

Cost analysis indicates that the processor accounts for about one-third of the overall manufacturing cost. Considering additional costs (R&D, support functions, etc.) and the selling price of the TV box, Yole SystemPlus estimates that profit margins are slim. This suggests that TV boxes might primarily serve as a gateway to draw customers into each company’s broader ecosystem.

Through these teardowns, three distinct business models are highlighted:

  • Apple: By having internal design capabilities, Apple only outsources the manufacturing of its processors to TSMC.
  • Amazon: By partnering with Mediatek, Amazon makes the choice of a well-established Taiwanese APU provider which most likely relies on TSMC for the manufacturing step.
  • Google: Google’s strategy brings into play Amlogic, a company with strong Chinese connections despite its American facade. The chip manufacturer remains unidentified, with two possibilities: TSMC, traditionally a partner for Shanghai-based firms, or SMIC, potentially favored due to local ties.



Stay tuned for our next What’s in the box? review!


Yole SystemPlus Teardown Tracks provide detailed physical and cost analyses, led by experts with deep academic and industry experience in semiconductors. These teardowns deliver clear insights into the technical choices of leading manufacturers and reveal precise data on manufacturing costs. Covering the full supply chain, from components to systems, Yole SystemPlus, part of Yole Group, leverages daily technical and industrial monitoring to drive innovation.


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About the authors

Benjamin Pussat is Senior Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, he is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, Benjamin contributes to the construction of block diagrams.

Benjamin holds a University Diploma in Technology in Electrical Engineering and Industrial Computing (Université de Nantes, France).

Corentin Querard is an Analyst, System Teardowns, at Yole Group.

With his expertise in reverse engineering and costing, Corentin is responsible for dissecting electronic boards and identifying mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, he contributes to the construction of block diagrams.

Corentin holds a University Advanced Technician Diploma (BTS), Digital & Communication Electronic System , from Eugene Livet High School in Nantes (France).

Maël Guilloteau serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, Maël is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, he contributes to the construction of block diagrams.

Maël holds a University Advanced Technician Diploma (BTS): Digital & Communication Electronic System from Eugene Livet high school in Nantes (France).




This article has been written in collaboration with Pierre Cambou, Principal Analyst, Global Semiconductors at Yole Group.




Sources: www.yolegroup.com

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