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WHAT’S IN THE BOX? Xpeng G6 vs. Volkswagen ID3: a BMS comparison at a glance

Both Xpeng G6 and Volkswagen ID3 BMS (Automotive Battery Management System) use a master-slave topology. Significant design strategy options were observed at the BMU (Battery Measurement Unit) level.

In the recent report Battery Management System (BMS) for Electric Vehicles 2023, Yole Group looked into the fast-expanding market of BMS for electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). This market, projected to grow at a compound annual growth rate (CAGR) of 15.6% from 2022 to 2028, is closely tied to the swift adoption of electric vehicles (EVs), and should reach nearly $12 billion by 2028.

Today, the BMS business is increasingly integrated into the manufacture of cars and batteries. OEMs like Tesla are extending their in-house manufacturing strategies to include BMS, alongside e-axles and battery packs. On their side, battery pack/cell suppliers use their extensive knowledge of battery design and cell chemical process to provide comprehensive cell data to BMS. In addition, automotive Tier 1 companies offer BMS as part of a broader range of electrification products, including onboard chargers (OBC), DC/DC converters, and inverters. This supply chain landscape does not favor strong M&A activity in the sector.

The BMS, often referred to as the brain of the EV battery system, is crucial for ensuring optimal and safe battery performance. In PHEVs, a centralized topology is commonly used, while BEVs, featuring larger battery capacity than PHEVs, typically employ a master-slave topology. This involves a Battery Control Unit (BCU) acting as the master and multiple BMUs serving as slaves.

Highlights from Yole SystemPlus Teardown Tracks

Continuing this global overview, Yole Group provides a technological and cost comparison between the Xpeng G6 BMS, manufactured by the Chinese Tier 1 company PSA ITC, and the Volkswagen ID3 BMS, supplied by Huber Automotive. Both systems employ a master-slave topology. The Yole SystemPlus analysis includes teardowns of the BCU and two BMUs for each system: Slave 4 and Slave 3 for the PSA ITC system, and Slave 4 and Slave 1 for the Huber BMS.

Significant design differences are reported when comparing the BMUs:

  • For PSA ITC, the same board is used for both Slave 4 and Slave 3. Although Slave 3 is not space-optimized, this approach provides a flexible architecture that allows higher-end car models to be targeted without additional development costs.
  • In Huber BMUs, a notable portion of the board—20% for Slave 4 and 50% for Slave 1—is dedicated to processing functions, enabling initial decision-making at the BMU level. Moreover, the slaves include CAN communication components. Cost is logically impacted by this design choice: Huber’s Slave 4 is 20% more expensive than PSA ITC’s Slave 4.

Apart from the board area (285 cm² for PSA ITC versus 270 cm² for Huber) and shape, the BCUs show no remarkable differences. The cost of the master unit in the PSA ITC system is estimated to be 7% more than Huber’s. It is also worth noting that all boards are manufactured locally by local players, a particularly uncommon scenario for a European Tier 1 manufacturer.

Stay tuned for our next What’s in the box? review!

Yole SystemPlus Automotive Teardown Tracks are the result of detailed physical and costing analyses. They are carried out by experts with academic and industrial backgrounds in the semiconductor domain. Yole SystemPlus Automotive Teardown Tracks offer a clear and fruitful understanding of the technical choices made by the leading manufacturers. It also reveals accurate insights related to manufacturing costs.

The company covers the overall supply chain from the components to the system. Based on daily technical and industrial monitoring, Yole SystemPlus has significant expertise to support innovation.

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About the authors

Guillaume Robichon serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, he is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, Guillaume contributes to the construction of block diagrams.

He has expertise in various systems, including ADAS, radars, as well as Electrification, Infotainment, and Telematics modules for automotive applications. He also conducts analyses focused on consumer products such as smartphones, smartwatches, and routers. And he has also published numerous Yole Group’s articles focused on systems teardown. Furthermore, he plays a key role in developing and updating Yole Group’s display costing software.

Guillaume holds a University Diploma in Technology in Electrical Engineering and Industrial IT from Nantes University (France).



Corentin Querard serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, Corentin is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, he contributes to the construction of block diagrams.

Corentin possesses expertise in various systems, including ADAS, as well as Electrification, Infotainment, and Telematics modules for automotive applications. Additionally, he conducts analyses focused on consumer products such as smartphones. And he has also published numerous Yole Group’s articles focused on systems teardown.

Corentin holds a University Advanced Technician Diploma (BTS): “Digital & Communication Electronic System (SNEC)” from Eugene Livet High School in Nantes (France).



Maël Guilloteau serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, Maël is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, he contributes to the construction of block diagrams.

Maël has expertise in various systems, including ADAS, as well as Electrification, Infotainment, and Telematics modules for automotive applications. Additionally, he conducts analyses focused on consumer products such as smartphones. And he has also published numerous Yole Group’s articles focused on systems teardown.

Before joining Yole Group, Maël studied at Eugene Livet High School in Nantes, where he gained expertise in the design and manufacturing of electronic systems for digital and communication applications. Maël holds a University Advanced Technician Diploma (BTS): Digital & Communication Electronic System (SNEC) from Eugene Livet high school in Nantes (France).



This article has been written in collaboration with Milan Rosina, PhD, Principal Analyst, Power Electronics and Battery, and Yu Yang, PhD, Principal Analyst, Automotive Semiconductors at Yole Group.



Source: www.yolegroup.com

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