EXPRESS Teardown & DEEP-DIVE TEARDOWN TRACK
Over the last years, Yole Group and Fomalhaut have collaborated on multiple reverse engineering projects with the shared goal of identifying and understanding the latest innovations. In numerous teardowns, the partners have addressed questions from the industry and provided an overview of the technology choices made by leading companies.From system to components, get quick access to all of the data from the latest released products for Samsung Galaxy S23 Series (Samsung Galaxy S23, S23+ & S23 Ultra)..
Yole SystemPlus and Fomalhaut join forces to provide you a two-in-one teardown of these devices: a quick version available right now furnish you a best-in-class overview of the main boards and components, and a more detailed, down to the semiconductor level in a few weeks.
Each step of the teardown track process is carefully documented by our experts, presenting detailed insights into component parts and costs as well as chip system functionality.
1. EXPRESS TEARDOWN TRACK
- PCB-level IC and component function/manufacturer identification in PowerPoint
- BOM cost (with all parts counted) in Excel
- Approx. 150 high-resolution photos
> 1.500€
2. DEEP-DIVE TEARDOWN TRACK
- Online web-based teardown with high-resolution pictures at every step
- Highly detailed block diagram
- All ICs identified, including IC X-ray, IC package decap, die size & pictures, and technology node
- Detailed parts lists with fully-estimated BOMs
- mmWave model analyzed
> 5.490€
Delivery schedule
- Express Teardown Track
- First phone: four days after release
- Second phone: four days after predicted report release
- Deep-dive Teardown Track
- First phone: three weeks after release
- Second phone: three weeks after predicted report release
Delivery by electronic softcopy download or on-line portal
Sensing and Actuating
Fortemedia unveils groundbreaking coil-based MEMS speaker product family–ForteSound – supporting ultra HD music
Compound Semiconductor
With or without Apple, the microLED industry maintains its momentum
Memory
Micron first to production of 200+ layer QLC NAND in client and data center
Photonics and Lighting
TSMC reportedly targeting 2025 and 2027 for next-generation 2nm and 1.4nm processes
Display
Q-Pixel debuts the world’s highest resolution (6800 PPI) color display
Global Semiconductor Trends
Yole Group Viewpoint – Exploring semiconductor equipment during a geopolitically charged era
Computing and Software
Renesas introduces new entry-level RA0 MCU series with best-in-class power consumption
Semiconductor Equipment
Mycronic receives order for an SLX mask writer
Computing and Software
FPGA market set for steady demand growth
Compound Semiconductor