AGENDA- IR Imaging Forum

Document sans nom



September 8th, 2016


09:00 – 9:20 – Registration / Badge collection

09:20 – 9:30 – Welcome and IntroductionYole Développement and CIOE

Session 1 – 9:30 – 12:30 AM: EMERGING MARKET and OPPORTUNITIES

9:30 –9:55 – Uncooled IR Imaging Market Perspectives – Dr. Eric Mounier, Senior Analyst, Yole Développement

Abstract: Uncooled IR imagers will exceed the million units by 2021. This is quite impressive growth when compared to the less than 300k units in 2010. This market is today driven by thermography, surveillance applications but other market are interesting promises such as automotive, consumer, smart homes … Until now, this market has been under the roof of a few concentrated players like FLIR, ULIS … with micro bolometer technology. But we see game-changers coming. Low cost IR sensor technologies (thermodiodes, thermopiles, pyroelectrics …) are today competing in the ultralow-end segment. These technologies pave the way to companies like Heimann Sensor or Bosch … entering the competition. From the microbolometers side, new players are arriving from the MEMS industry and Asian players are growing as well that push the costs down. Yole will discuss all these trends as well as updated market forecast up to 2021 during his talk.

9:55 – 10:25 – Keynote – Low Cost Thermopile IR Arrays for High Volume Application, Joerg Schieferdecker, CEO and Co-Founder, Heimann Sensors

Abstract: Four basic technologies for low cost infrared arrays are introduced: Bolometer, Pyroelectric, Thermodiode and Thermopile. Some general properties, advantages and disadvantages of these technologies are discussed and compared. The main chapter describes state of the art of modern thermopile Arrays. Finally the paper deals with some selected actual and potential near future high volume applications.

10:25 – 10:50 – Thermodiode Infrared Technology for Mass Market Applications – Dr. Andreas Krauss, Product Management Sensor Components (AE/PRM-S) , Robert Bosch GmbH

Abstract: Infrared detection offers many attractive applications and use cases for mass markets, including non-contact temperature measurements, media sensors, and advanced presence detection. Respective sensors vary from single element detectors to high-definition focal plane arrays realized in different technologies ranging from thermopiles to resistive microbolometers. However, mass markets are very demanding in many aspects. Cost versus performance is a well-known tension field. Additional success factors include high delivery capacity and very good control of technological aspects and yield. A brief overview of the market environment with its general requirements and some examples for products including present technologies, typical properties and limitations are presented as a first part of the talk. A next section presents and discusses the unique thermodiode technology, which was developed by Bosch in the last years and which is originating from a standard MEMS process for automotive and consumer pressure sensors. The sensing element for infrared radiation comprises temperature diodes and an infrared absorber made from usual and well-known semiconductor materials. This is an important prerequisite for high stability. Reference elements allow to compensate for drift effects. The technology includes also a first level package solution, allowing for high scalability in terms of pixel count. The thermodiode elements absorb infrared light over a very broad wavelength range. The latter enables to implement different specialized products for a wide range of use-cases, which are all originating from an identical base technology. A final chapter of the talk presents several examples of applications and products which make use of the advantages of the thermodiode technology. A discussion of important key performance indicators follows, which also includes comparisons to alternative technological approaches and which shows limitations for all set-ups. An outlook will illuminate future prospects and opportunities.

10:50 – 11:15 – Tea break and networking

11:15 – 11:40 – Molded, Wafer Level Optics for High Volume Applications – John Franks, Technical Director, Umicore Electro Optic Materials

Abstract: For many years, the Thermal Imaging market has been driven by the high volume consumer market. The first signs of this came with the launch of night vision systems for cars, first by Cadillac and Honda and then, more successfully by BMW, Daimler and Audi. Today we see that the consumer awareness and the consumer market continues to increase with the launch of a number of consumer focused smart phone add-ons. This has brought a further step change in system costs, with the possibility to turn your mobile phone into a thermal imager for under $300. As the detector technology has matured, the pixel pitches have dropped from 50µm in 2002 to 12 µm or even 10µm in today’s detectors. This dramatic reduction in size has had an equally dramatic effect on the optics required to produce the image on the detector. A moderate field of view that would have required a focal length of 40mm in 2002 now requires a focal length of 8mm. For wide field of view applications and small detector formats, focal lengths in the range 1mm to 5mm are becoming common. For lenses, the quantity manufactured, quality and costs requires a new approach to high volume IR manufacturing to meet customer expectations. This, taken with the SwaP-C requirements and the emerging requirement for very small lenses driven by the new detectors, suggests that wafer scale optics are part of the solution. Umicore has developed a wafer level process based on its chalcogenide glass, GASIR and we can now present our experience in the molding and coating wafer level lenses.

11:40 – 12:05 – Fabless Development of CMOS Micro-bolometer FPA for High Performance Consumer Application – Kwyro Lee, CTO of Sirius Inc. & Prof. in School of EECS, KAIST, Daejon, Korea

Abstract: Recently smart phone and IoT bring huge market opportunity for SoC(Sensor-on-Chip), justifying sensor development and manufacturing using state-of-the-art CMOS technology as well as industry infra-structures. Among them, MBFPA (Micro-Bolometer Focal Plane Array) for consumer application is one of the remaining big items. MBFPA, invented in 1980’s, has mostly been used in military as well as thermography markets. Because these industries are very much closed, their progress has been very slow. This is quite in contrast with CMOS industry revolution, whose exponential speed has known as Moore’s law. Another unique feature of semiconductor industry is that it provides open and standardized manufacturing services with guaranteed quality, cost and delivery time, allowing stand-alone fabless company. Thus it is a right time to start fabless MBFPA Company now. Sirius is a company established in 2015 to do this. Firstly, it developed MBFPA fabrication technology that can be manufactured at commercial CMOS foundry. Secondly, it developed integrated MBFPA SoC design and statistical analysis environment using current CMOS design tools such as Cadence-Vituoso AMS combined with Matlab. Thirdly, it developed MBFPA wafer level testing and statistical evaluation technologies with commercial testing house. This is followed by development of high thru-put mass calibration technologies. Above all, it developed highly sophisticated systematic concurrent engineering development methodologies to minimize risk. As a result, we succeeded to obtain fully functional 35um pixel 80*60 MBFPA prototype with shutter-less read-out scheme in 7 months at a 1st trial, having performance comparable to the existing ones and QCD comparable to CMOS IC’s. I will share the approach and result at the conference.

12:05 – 12:30 – NETD and Shutter-less challenge of uncooled IR camera for demanding applications –Frédéric Mathieu, Chief Operating Officer & Project Manager, Device-ALab

Abstract: Nowadays, NETD (Noise Equivalent Temperature Difference) of high-sensitivity uncooled infrared detector, such as micro bolometers, is less than 50mK, and this performance is naturally expected at camera level, which also requires, as a general trend, more services like compactness, low power consumption, lightweight, shutter-less…. The challenge on the module design is to provide this detector NETD performance to the end user, for highly integrated module, taking into account some trade-off during the integration as ultra-low noise power supplies, bias, and analog to digital acquisition video chain, etc…. SmartIRTM module family supports the different ULIS micro-bolometer detectors and ensures a superior electronic and mechanical integration for demanding applications. This paper shows the NETD results achieved for SmartIR module families, especially for the VGA format able to withstand 120fps full frame with a 30x30x18mm size supporting TWS (Thermal Weapon Sight) application. NETD in different configurations, including optics, will be disclosed, explaining the results obtained with some easy rules of thumb as well as the method used. Some module settings are disclosed to optimize sensitivity performance or scene dynamic while preserving NETD. As mechanical performance and thermal management directly impact applications, the TWS stress method and its impact on application, is presented. And finally, we propose an overview of the shutter-less capability and achieved image quality over FPA (Focal Plan Array) temperature.

12:30 – 1:30 – Lunch and Networking



1:30 – 2:00 – Keynote – Night Vision for Every Car, Stuart Klapper, Managing Director, Autoliv Global Night Vision

Abstract: Night Vision was first offered on the 2000 Cadillac Deville. The cost and integration complexities limited widespread use. As improvements in technology and cost reductions occur, more and more cars will adopt this life saving technology. Night Vision uses an infrared camera mounted in the front grille of the vehicle that senses temperature differences, making objects on the road visible to the driver even through darkness, fog and smoke. Autoliv’s custom algorithms detect animals and pedestrians in the path of the vehicle, and enables alerts to the driver through icons in the instrument cluster and head-up display. If the vehicle is in danger of a collision with a pedestrian or animal, a rapid beeping tone or pulsing of the safety alert seat is activated. Autoliv is developing next generation technology to improve the cost, size and performance. Future driving needs will drive the need for more infrared sensors to handle special use cases. Autoliv sees a future where every car will use infrared sensors.

2:00 – 2:25 – Thermal and Hyperspectral Imaging solutions for Integrators – Eric Guyot, Director French Office and IR Cameras Product Line Manager, Telops

Abstract: Telops specializes in hyperspectral imaging technology and series products of high-performance refrigeration type infrared thermal imager which include the global exclusive high-definition infrared movement, middle and long wave infrared low-power movement product line and multispectral infrared imaging, dynamic range, super-speed thermal infrared imager and other IR core technologies and related applications.

2:25 – 2:50 – ULIS inside “Smart Buildings” – Cyrille Trouilleau, Product Manager, ULIS

Abstract: Smart Building application and Internet of Things both require significant improvement in their ability to sense the environment. In order to optimize workspaces, occupant comfort and energy management (HVAC, lighting, etc.), these systems not only require to sense human motion (currently performed by PIR sensors) but need to count, localize and classify body motion and positioning. IoT drives the development of smart sensors that can be easily deployed and connected to the Cloud gathering the required information from the process, and the assets and to understand people behaviour to enhance the control strategies and services. The latest developments in the Microbolometer-based Thermal Sensors industry now enable new sensors to have a more pertinent impact in this domain. Because of these significant breakthroughs, ULIS is now able to deliver low consumption and user friendly products compatible with mass production handling and assembly processes. The Ulis key technical developments such as embedded smart functions, patented Pixel packaging, and ease of implementation will lower acquisition cost, streamline project lead times and optimize time to market. Presentation will describe the Smart Building requirements and then focus on the second generation of thermal sensors designed for a wide range of applications for Smart Building, Smart lighting and home automation.

2:50 – 3:15 – Tracking Illuminator: Novel Instrument Combining Thermal IR Detection with VIS Illumination – Alain Bergeron, Optronic System Program Manager, INO

Abstract: The Tracking Illuminator represents a new technology in the field of enhanced situational awareness designed to improve the detectability of objects in dark or reduced visibility conditions. It combines an uncooled thermal IR camera with a VIS pixelated light source. The Tracking Illuminator automatically detects objects of interest such as humans, animals and operating engines. Once detected only the object silhouette is selectively illuminated against the background. This provides a tremendous gain in surveillance and searching efficiency. The effective resolution of this instrument is only limited by the observer’s ability. The Tracking Illuminator can perform continuous tracking of multiple moving targets simultaneously. The targets are individually illuminated and followed. Depending on the camera resolution, optics field of view and the light source power tracking of targets at a distance up to few kilometers is possible. Prototypes of both portable and hand-held Tracking Illuminators have been developed. Two models of tripod-based instruments were produced, one with detection pattern resolution of 160×120 pixels and the other with 640×480 pixels. The corresponding light source powers are 200 lumens and 2200 lumens. The hand held battery-powered instrument has a resolution of 364×208 pixels and an illumination power of 20 lumens. The identified fields of application include: automotive (pedestrian/obstacle avoidance), border/perimeter security, search and rescue, defense (surveillance), leisure/hunting, and entertainment.

3:15 – 4:00 – Tea break and networking

4:00 – 4:25 – Thermal Imager with Microbolometer for Smartphone: Evolution & Comparison on the last Technologies Trends – Romain Fraux, Project Manager, System Plus Consulting

Abstract: Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. A +15.8% per year shipments growth over 2015-2021 driven by commercial and consumer markets is expected according to Yole Developpement. A rapid price erosion especially in commercial and consumer markets occurred with the arrival of new players like Seek Thermal. Consistent sales growth is expected, with new technologies like augmented reality potentially opening a new world of opportunities. However, this will only be possible if a significant cost reduction of the camera module is realized. Yole estimates that, with an optimistic scenario and successful user cases, uncooled thermal sensors in smartphones could be almost 10Munits by 2021. To realize this cost reduction, technological innovation is crucial. FLIR is actually driving this innovation with its LETPTON camera cores, mixing fine pixel architecture (12µm), wafer-level packaging (WLP) and wafer-level optics (WLO). To highlight the last technologies trends, we will make a technological and cost review with comparison of several actual smartphone thermal cameras. With photos taken from our physical analyses, we will describe and compare the design, manufacturing construction and cost structures of thermal cameras coming from FLIR, Seek Thermal, Opgal and I3system.

4:25 – 4:50 – Application of SWIR Imaging Technology – Liehua Zheng, Director of Photoelectric Manufacturing Engineering Center, Shanghai Institute of Technical Physics, CAS

Abstract: The Shortwave Infrared (SWIR) range (wavelength from 0.9 to 2.5 microns), as one of the most important atmospheric window, offers unique capabilities. Unlike the LWIR or MWIR sensors, which are able to spot targets based solely on their heat emissions, SWIR cameras and sensors see reflected light in the shorter wavelengths. As a result, the images are close representations of what is seen in the visible spectrum. This makes objects easily recognizable. Comparing to the visible cameras, SWIR cameras and sensors is capable of providing high quality images in severe atmospheric condition such as low light, rain, fog and mist. This report will briefly introduce achievements had been made by Shanghai Institute of Technical Physics (SITP) in SWIR imaging system. The report will also focus on the newly developed InGaAs detector and several lens (fixed focal and zoom lens) designed for SWIR light. Beside the optical principle, imagery and videos will also be shown in presentation as samples.

4:50 – 5:15 – CMOS Infrared Sensors (CIS) – Prof. Dr. Tayfun AKIN, Co-Founder/President, Mikrosens, Director/METU-MEMS Center

Abstract: TBD

5:15 – 6:15 – Cocktail and networking


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