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Presentations Advanced Packaging & System Integration Technology

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 Download below the presentations made available by the speakers.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 – Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates  Here
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Fan Out Packaging Market Trends – Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution – Here
Lewis Kang, Global Marketing Unit., Director, nepes Corporation

11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost – Here
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape  Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement


1:45 PM – 3:25 PM: Session #2 – 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration  Here
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution  Here
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review  Here
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors  Here
Dr Wenqi Zhang, Technical Director, NCAP



4:10 PM – 5:25 PM: Session #3 – Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach  Here
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications Here
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing  Here
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 – Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: Temporary Bonding for FOWLP and Advanced Packaging Here
Dr. Thomas Uhrmann, Business Development Director, EV Group

9:45 – 10:10 – Direct Write Lithography for Advanced Semiconductor Package Combination with Slit Coating Here
Olivier Vatel, CTO, SCREEN Semiconductor Solutions

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package  Here
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die  Here
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging  Here
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

2:00 PM – 4:15 PM: Session #5 – Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module  Here
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging  Here
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications  Here
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive  Here
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen  Here
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


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