China Int’l Electronics Manufacturing Summit & Advanced Packaging Forum – NEPCON China – 2019

China Int’l Electronics Manufacturing Summit & Advanced Packaging Forum is part of the ” Electronic Micro-assembly and SiP Process Pavilion ” which, in line with the concept of Packaging + PCBA, serves as a comprehensive professional exhibition platform of electronic micro-assembly, circuit board assembly and finished product assembly that leads the development trend of advanced packaging industry.  The Pavilion will attract core buyers from industries such as wireless communications, automotive electronics, medical electronics, computers, military electronics which have the packaging and testing demand, as well as integrated circuit design enterprises, and electronic product design enterprises.

Be part of this forum partnered by Yole Développement – Organized and hosted by Reed Exhibitions and CCPIT, and get the opportunity to listen to key players presentation.

Yole Développement will participate in the following:

Keynote at the China Int’l Electronics Manufacturing Summit & Advanced Packaging and Micro-assembly Forum, on April 25^th from 9:30AM to 10:00AM

Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea, Semiconductor & Software Division at Yole Développement

In addition, Yole Développement will be exhibiting at the Electronic Micro-assembly and SiP Process Pavilion with our experts on hand to answer questions and discuss your needs.