Industry Insights
Computing and Software
AI WHITE PAPER COLLECTION
Photonics and Lighting
ARTIFICIAL INTELLIGENCE WHITE PAPER – PHOTONICS (Vol.2)
Computing and Software
Pasqal Shares Nearly Double in Nasdaq Debut
Computing and Software
ARTIFICIAL INTELLIGENCE WHITE PAPER – MEMORY & COMPUTING (Vol.1)
Semiconductor Packaging
Advanced packaging comes home
Computing and Software
China’s Xiaomi is planning a next-gen phone chip, but won’t release one yearly like Apple
Global Semiconductor Trends
RETHINKING THE SEMICONDUCTOR SUPPLY CHAIN – OPINION SERIES
Computing and Software
Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation
Computing and Software
Navitas To Acquire Claros, Advancing AI Infrastructure with VPD & IVR Technology for Grid-to-xPU
Semiconductor Packaging
Nordson Electronics Solutions Launches the New ASYMTEK Vantage XL Fluid Dispensing System for Panel-Level Packaging at SEMICON Taiwan 2026
Global Semiconductor Trends
Melexis becomes a direct supplier to BYD, deepening global EV collaboration
Sensing and Actuating
NOVOSENSE × Yole Group: global magnetic sensor market set to reach USD 4.3 Billion — Exploring technology evolution and application opportunities
Sensing and Actuating
TDK acquires assets from OQmented to advance AR display technologies
Sensing and Actuating
Yole Group’s MEMS Industry 2026 report confirms: Bosch is one of the top leaders in the MEMS market
Battery
Eolian announced that Flint Grid, a 200MW, 5+hour duration grid-scale battery energy storage system in Jersey Township, Licking County, Ohio, has started construction
Semiconductor Equipment
Lam Research Announces Plans to Invest More than $3B to Expand Global Lab Network, Increase Innovation Velocity in the AI Era
Sensing and Actuating
sensiBel and Aizip Deliver Superior Physical AI to Speech Applications, Improving Clarity and Intelligibility
Sensing and Actuating
Si-Ware Systems and SEMC Partner to Advance MEMS Sensing Technologies in Saudi Arabia
Computing and Software