Mobile & Consumer

Mobile and consumer electronics drive constant innovation, fueled by advances in sensing, imaging, RF and computing semiconductor technologies. Combined with cutting-edge packaging and manufacturing processes, these technologies enable OEMs to develop smarter, more powerful, and increasingly integrated devices for everyday life.

BILLIONS OF DEVICES, ONE RELENTLESS INNOVATION CYCLE

From smartphones to wearables, mobile and consumer electronics represent one of the highest-volume, fastest-moving markets in the semiconductor industry. Short renewal cycles and fierce competition push OEMs to integrate new functionalities including AI, advanced connectivity and RF, smarter sensing, faster than ever, reshaping supply chains at every turn.

Jérôme Mouly, Director, Sensing & Actuating activities at Yole Group – “Sensing technologies are no longer just capturing data. They’re feeding it directly into on-device computing, turning every sensor into an intelligent decision point.”

OUR PRODUCTS

INDUSTRY INSIGHTS

WHITE PAPERS

WHEN OEMS BECOME CHIPMAKERS

A growing number of OEMs are no longer just buyers of semiconductor technology. Indeed, they’re becoming designers of it.

From application processors to RF front-ends, leading consumer brands are developing their own chips and choosing their own supply partners, redefining the competitive landscape and accelerating the pace of innovation.

OUR OUTLOOK

TRACKING TECHNOLOGY AS IT HAPPENS

For over 20 years, Yole Group has followed mobile and consumer electronics from the system down to the semiconductor die. Through market research, reverse engineering, and reverse costing, we decode the semiconductor technology choices shaping tomorrow’s devices, before they hit the mass market.

Our teardown of Apple’s iPhone 17 Pro Max Face ID module is a perfect example: our analysts identified the first integration of a nanopillar-based metasurface DOE paired with a stacked NIR CIS, revealing a significant cost reduction versus the prior optical architecture. This level of granularity, down to die area, process node, and manufacturing yield, is what lets us translate a single teardown into a strategic roadmap for the entire supply chain. Read the related article: Apple’s iPhone 17 Face ID: First metasurface integration marks a technology shift

CONNECTING THE DOTS ACROSS THE SUPPLY CHAIN

Innovation does not happen in isolation.

We help you understand how sensing, imaging, computing, RF, packaging, and manufacturing come together to unlock new performance, new form factors, and new value, giving you the roadmap to anticipate what’s next.

Discover our collection of Mobile & Consumer products here.