Industry Insights
Global Semiconductor Trends
$2.4 trillion by 2031: welcome to the new semiconductor math
Computing and Software
Navitas and Magnachip Announce Strategic Partnership to Accelerate High-Voltage and Ultra-High-Voltage Silicon Carbide Adoption
Sensing and Actuating
Cambridge’s Silicon Microgravity secures €7.08 million to scale its GPS-free sensing and navigation tech
Compound Semiconductor
Bosch announces $225 million direct funding agreement with the U.S. Department of Commerce as part of a $2 billion investment in Roseville, Calif.
Memory
What a year for memory!
Sensing and Actuating
Robot safety is now 3D: Sonair unveils world’s first safety-certified 3D ultrasonic sensor for human-robot collaboration
Power Electronics
Daimler Truck sold 1,405 battery-electric trucks and buses in the second quarter of 2026, 21% more than in the same period last year.
Semiconductor Packaging
Inspection and metrology catching up for high-density fan-out panel packaging
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
From IPO to expansion: Silex’s next growth chapter
Sensing and Actuating
Roche announces the launch of AXELIOS 1, a transformative next-generation sequencing platform
Power Electronics
Iberdrola inaugurates Fénix, its largest photovoltaic plant in Italy with 243 MW
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Photonics and Lighting
Grant notification presented: X-FAB develops Erfurt site into a center for microsystems technology
Semiconductor Equipment
Accepting Orders for the LED Light Source–Equipped New Products “UX-44101SCB / UX-45114SCB” of the UX-4 Series, Full Field Projection Aligner for Wafers
Battery
TEPCO and Daiwa House Industry Co., Ltd. signed a business alliance agreement pertaining to the co-development of the grid-connected battery storage station.
Battery
Forsee Power and Wabtec collaborate to equip locomotives with advanced battery systems
Imaging
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance
Compound Semiconductor