Industry Insights
Display
xMEMS Launches the World’s Smallest Active Micro Fan to Break the Thermal Wall in Smart Glasses
Semiconductor Equipment
Innolume Selects Veeco Gen2000™ MBE System to Expand Quantum Dot Laser Production
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Semiconductor Equipment
Accepting Orders for the LED Light Source–Equipped New Products “UX-44101SCB / UX-45114SCB” of the UX-4 Series, Full Field Projection Aligner for Wafers
Photonics and Lighting
Aehr Receives Follow-On Order from Major Silicon Photonics Customer for Fully Automated Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect
Photonics and Lighting
Making qubits is hard and manufacturing them even harder
Semiconductor Equipment
ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Teradyne and TEL Collaborate on Advanced Packaging Test Solution for AI Devices
Computing and Software
Invisix raises €20M seed round to bring soft x-ray metrology to AI-era chip manufacturing
Memory
Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy
Compound Semiconductor
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
Compound Semiconductor
Veeco announces $250 Million+ in equipment orders for manufacturing Indium Phosphide lasers
Semiconductor Equipment
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
Semiconductor Packaging
Breaking the wafer barrier: how advanced packaging is scaling in the AI era
Semiconductor Equipment
Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer; Second-Half Bookings Exceed $92 Million
Semiconductor Equipment
New ZEISS Crossbeam 750 FIB-SEM for high-accuracy sample preparation workflows
Semiconductor Equipment
Exclusive-Besi fields takeover interest on surging demand for advanced chip packaging, sources say
Global Semiconductor Trends
BESI at the center of the packaging power shift
Compound Semiconductor