Industry Insights

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Computing and Software

Intel launches world’s first systems foundry designed for the AI era

Semiconductor Equipment

Next-generation chips: is semiconductor testing ready?

Battery

Sony, Honda EV venture to roll out three models before 2030 – Nikkei

Computing and Software

Pushing silicon boundaries: advanced semiconductor packaging for high-end performance

Semiconductor Equipment

ASML’s High-NA chipmaking tool will cost $380 million — the company already has orders for ’10 to 20′ machines and is ramping up production

Compound Semiconductor

Compound semiconductors are changing the power, RF and photonic industries

Compound Semiconductor

MBE becomes critical for high quality GaAs and GaN epitaxy – An interview with Veeco

Compound Semiconductor

First consumer microLED displays are just a start

Oxford Instruments supplies ALD technology for microLED to key UK manufacturer for augmented reality and advanced consumer devices

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Compound Semiconductor

RIBER – Major order for three production machines in Asia

Compound Semiconductor

WiPDA 2023: The 10th Edition of the IEEE Workshop on WBG Power Devices

Compound Semiconductor

Renesas & Transphorm: Infineon Technologies opens the doors for bold acquisitions in power GaN

Semiconductor Equipment

RIBER: Order for MBE production machine and services in Europe

Semiconductor Equipment

Riber launches MBE 8000 for mass epiwafer production

Battery

Compare IC Technology and Costs: The right tool to assess your option

Semiconductor Equipment

Imec and Mitsui Chemicals sign strategic partnership agreement to commercialize CNT pellicle technology for EUV lithography

Semiconductor Equipment

Breakthrough digital lithography technology from applied materials and ushio to enable more powerful computing systems for the AI era

Semiconductor Equipment

RIBER order for two MBE 6000 production machines in Asia

Semiconductor Equipment

DNP develops photomask process for 3nm EUV lithography

Semiconductor Equipment

EV brings revolutionary layer transfer technology to high-volume manufacturing with EVG(R)850 nanocleave™ system