Industry Insights Articles

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Compound Semiconductor

Aehr receives volume production order for wafepak full wafer contactors from major silicon carbide semiconductor customer for test and burn-in of silicon carbide semiconductor wafers

Semiconductor Manufacturing

Lithoptek has announced the release of the CD Optimizer (CDOP)

Semiconductor Manufacturing

MKS Instruments introduces integrated approach to creating solutions for complex package substrate manufacturing requirements and roadmaps

Semiconductor Manufacturing

Canon introduces a new lithography system with large exposure field at a high resolution for producing full-frame CMOS sensors, XR devices and others

Semiconductor Manufacturing

Mycronic receives order for an SLX mask writer

Semiconductor Manufacturing

Mycronic receives order for a prexision 8 Evo and an FPS 6100

Semiconductor Manufacturing

SCREEN plans to launch new Ledia 7F-L large-format Direct Imaging System in April

Semiconductor Manufacturing

Screen expands lineup of LeVina direct imaging systems

SK hynix developing Nand flash with more than 300 layers

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Semiconductor Manufacturing

New Canon wafer measurement equipment improves productivity of lithography systems, enabling high-precision alignment for increasingly complex semiconductor manufacturing processes

Computing and Software

Applied Materials’ innovative pattern-shaping technology reduces the cost, complexity and environmental impact of advanced chip manufacturing

Computing and Software

Applied materials’ new eBeam metrology system paves the way to High-NA EUV lithography

Compound Semiconductor

Veeco’s acquisition of Epiluvac signifies move towards silicon carbide

Computing and Software

iPhone technologies – The chronicles by Yole SystemPlus

Semiconductor Manufacturing

Mycronic receives order for an SLX mask writer

Memory

Silicon Motion launches third generation PCIe Gen4 SSD controller for future TLC and QLC 3D NAND flash

Display

RIBER: Order for a new MBE production system in Asia

Power Electronics

Texas instruments selects Lehi, Utah, for its next 300-millimeter semiconductor wafer fab

Compound Semiconductor

Oxford instruments receive tier 1 orders for indium phosphide high volume manufacturing solution