Industry Insights Articles

Computing and Software
Unveiling the iPhone 15 Pro Max and A17 Pro Processor – The Chronicles by Yole SystemPlus

Semiconductor Manufacturing
Amkor announces US advanced packaging and test facility

Semiconductor Manufacturing
EV completes construction of new manufacturing V building at corporate headquarters to expand production capacity

Memory
Veeco ships first 300mm ion beam deposition system to tier 1 memory customer

Power Electronics
Oxford Instruments receives orders for GaN ALE and ALD systems from several key Japanese power electronics and RF foundries

Semiconductor Manufacturing
Time-saving and more centering options: Updates for TRIOPTICS alignment turning stations

Semiconductor Manufacturing
Samsung gears up for 3D chip packaging revolution with SAINT technology

Semiconductor Manufacturing
JST introduces ospray single-wafer wet processing family

Semiconductor Manufacturing
AG produces first wafers in its new Singapore fab

Semiconductor Manufacturing
Temporary bonding solutions from SUSS MicroTec enable rapid expansion of AI applications and let production in Taiwan grow

Computing and Software
Can Chinese chiplets dodge export controls?

Compound Semiconductor
2023 Silicon Photonics Outlook

Semiconductor Manufacturing
SUSS MicroTec receives record orders for bonders in the third quarter / Sales momentum slowed by delays in shipments to China

Semiconductor Manufacturing
Leading edge semiconductor research on 200/300 mm wafers in the heart of Silicon Saxony and Europe

Compound Semiconductor
Vishay Intertechnology to acquire Nexperia’s Newport wafer fab for $177 million

Photonics and Lighting
SUSS MicroTec signs agreement to sell the MicroOptics division to Focuslight Technologies

Computing and Software
UMC launches W2W 3D IC project with partners, targeting growth in edge AI

Imaging
iPhone 15: going to the 3rd dimension

Semiconductor Manufacturing