Industry Insights Articles
Computing and Software
Unveiling the iPhone 15 Pro Max and A17 Pro Processor – The Chronicles by Yole SystemPlus
Semiconductor Manufacturing
Amkor announces US advanced packaging and test facility
Semiconductor Manufacturing
EV completes construction of new manufacturing V building at corporate headquarters to expand production capacity
Memory
Veeco ships first 300mm ion beam deposition system to tier 1 memory customer
Power Electronics
Oxford Instruments receives orders for GaN ALE and ALD systems from several key Japanese power electronics and RF foundries
Semiconductor Manufacturing
Time-saving and more centering options: Updates for TRIOPTICS alignment turning stations
Semiconductor Manufacturing
Samsung gears up for 3D chip packaging revolution with SAINT technology
Semiconductor Manufacturing
JST introduces ospray single-wafer wet processing family
Semiconductor Manufacturing
AG produces first wafers in its new Singapore fab
Semiconductor Manufacturing
Temporary bonding solutions from SUSS MicroTec enable rapid expansion of AI applications and let production in Taiwan grow
Computing and Software
Can Chinese chiplets dodge export controls?
Compound Semiconductor
2023 Silicon Photonics Outlook
Semiconductor Manufacturing
SUSS MicroTec receives record orders for bonders in the third quarter / Sales momentum slowed by delays in shipments to China
Semiconductor Manufacturing
Leading edge semiconductor research on 200/300 mm wafers in the heart of Silicon Saxony and Europe
Compound Semiconductor
Vishay Intertechnology to acquire Nexperia’s Newport wafer fab for $177 million
Photonics and Lighting
SUSS MicroTec signs agreement to sell the MicroOptics division to Focuslight Technologies
Computing and Software
UMC launches W2W 3D IC project with partners, targeting growth in edge AI
Imaging
iPhone 15: going to the 3rd dimension
Semiconductor Manufacturing