Industry Insights
Computing and Software
Avnet ASIC team launches ultra-low-power design services for TSMC’s 4nm process nodes
Compound Semiconductor
SEMICON West Show Daily 2024
Computing and Software
Semiconductor technologies evolving to meet generative AI demand
Semiconductor Equipment
Onto innovation further strengthens company’s panel portfolio with new glass suite
Global Semiconductor Trends
Resonac announces new US-joint consortium
Global Semiconductor Trends
Applied Materials unveils chip wiring innovations for more energy-efficient computing
Compound Semiconductor
SiC is in a race to meet growing demand for new technologies – An interview with STMicroelectronics
Semiconductor Equipment
2024 Wafer Fab Equipment revenue will remain stable before a 2025 surge
Radio Frequency
CEA-Leti announces launch of FAMES pilot line as part of EU chips act
Semiconductor Equipment
Shin-Etsu Chemical: Developing equipment to manufacture semiconductor package substrates for the back end process
Power Electronics
Siltronic ag celebrates the inauguration of the new fab in Singapore
Semiconductor Materials
Soitec extends partnership with UMC to provide engineered substrates for industry’s first 3D IC solution for RF-SOI
Semiconductor Materials
Glass Core substrates: the new race for advanced packaging giants
Compound Semiconductor
Malaysia targets over $100 bln in semiconductor industry investment
Semiconductor Materials
SCHMID Group takes next step towards advanced packaging for integrated circuits with glass cores
Compound Semiconductor
China sets up third fund with $47.5 bln to boost semiconductor sector
Semiconductor Materials
Biden-Harris administration announces preliminary terms with Absolics to support development of glass substrate technology for semiconductor advanced packaging
Computing and Software
Are we witnessing the first seed for a “Diamond Valley” in France? – An interview with Diamfab
Global Semiconductor Trends