Industry Insights
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Semiconductor Equipment
ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration
Semiconductor Materials
SCHMID Group announces Agreement for New China Manufacturing Campus to Support Future Growth
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Compound Semiconductor
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
Semiconductor Materials
SCHMID Group N.V. announces closing of the second tranche of its USD 30 million convertible notes financing
Semiconductor Materials
SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
Semiconductor Equipment
AI supply chain at risk: between T-glass shortage and emerging glass core
Compound Semiconductor
IMEC achieves a world record GaN breakdown voltage exceeding 650 V on Shin-Etsu Chemical’s 300-mm QST™ substrate
Memory
Exclusive-chipmaker CXMT plans Shanghai listing with $42 billion valuation, sources say
Semiconductor Materials
US critical materials and green Me tally for US gallium and critical mineral independence
Semiconductor Materials
Australia nimy signs MoU for sale of gallium to USA’s M2i global
Semiconductor Materials
US DOE’s TRACE Ga to fund gallium recovery from US metal processing feedstocks
Compound Semiconductor
Axcelis Technologies and Veeco Instruments to combine creating a semiconductor equipment company
Global Semiconductor Trends
Tekscend photomask targets 2 billion valuation in Japan IPO
Global Semiconductor Trends
2025 WHITE PAPER COLLECTION – UNLOCK THE FUTURE OF SEMICONDUCTORS
Semiconductor Equipment
China cracking global market for chip making equipment – Monthly Billet
Semiconductor Packaging
AI fuels the future of advanced packaging
Semiconductor Materials