18th International Conference and Exhibition on Device Packaging – IMAPS DPC

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Yole Développement will participate in the following:

On March 9, 2022
Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea

The industry is seeking alternatives to design and manufacture the latest Systems on Chips (SoCs) using System in Package (SiP) and chiplet-based approaches by leveraging Advanced Packaging to mix both the latest and mature nodes. In this regard, fan-out & 2.5D/3D packaging has emerged as the key technology choice for the heterogeneous integration. Fan-out packaging is growing at > 15% CAGR. 3D stacked packages include SoC (System on Chip), active interposer packages such as Foveros and Co- EMIB, 3D NAND, 3DS, HBM, and Stacked CIS packages.