Tradeshows & Conferences
2023 OCP GLOBAL SUMMIT
Scaling Innovation Through Collaboration
The OCP Summit is uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for this Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software.
At the 2023 Global Summit, industry leaders, researchers and pioneers from the open community will engage in dynamic dialogues, enlightening workshops, and interactive engineering sessions designed to expand their understanding of the progress that those projects have made as well as the challenges and road ahead. Participants will explore emerging trends, tackle complex challenges and discover new opportunities to drive global innovation.
Yole Group with be part of the program with:
Tom Hackenberg,
Principal Analyst, Semiconductor, Memory & Computing Division
Yole Intelligence
Panel Discussion Moderator on October 19th
Emerging Supply Chain for the Chiplet Economy
Tom Hackenberg
Principal Analyst, Computing & Software
Tom Hackenberg is Principal Analyst, Computing & Software at Yole Group.
Tom is an industry leading expert reporting on markets for semiconductor processors including CPUs, MPUs, MCUs and DSPs, SoCs, GPUs and discrete accelerators, FPGAs, and configurable processors since 2006. Tom is also well-versed in related technology trends including AI and edge computing, IoT, heterogeneous processing, chiplets, as well as vertical markets like automotive, computing and telecommunications where processor trends play a significant role.
Tom has appeared as a presenter on these topics at associated events as the Chiplet Summit, OCP ODAS Workshop on Chiplets, Rosenblatt’s Age of AI Scaling, System-on-Chip Conference, Vision and AI Summit, Xilinx Adapt: Automotive: Anywhere, Yole Group’s events and as well as custom proprietary presentations.
He can also be found quoted or bylined in news and trade publications such as Cision, Computerworld, Design and Reuse, EE|Times & EE|Times Asia, Fierce Electronics, Insider, Semiconductor Engineering, VentureBeat, and more for expertise on the processor market.
Tom worked with market-leading processor suppliers developing both syndicated and custom research. He holds a BSEE/BSECE from the University of Texas at Austin specializing in processors and FPGAs.
