Tradeshows & Conferences
2024 OCP REGIONAL SUMMIT
Charting a Sustainable Data Future
In Europe, the escalating demand for data center capacity presents formidable challenges driven by the relentless expansion of data volume and the integration of high-performance computing workloads, such as generative AI applications. This surge not only impacts energy consumption but also amplifies concerns regarding water usage and the imperative for superior construction materials. Addressing these challenges necessitates a systemic overhaul to ensure sustainability and efficiency.
Join Yole Group at OCP Regional Summit in Europe which stands as a pivotal platform where technical and business leaders from EMEA converge to confront critical issues related to data center sustainability, energy efficiency, and heat reuse. The focal point is on exploring how innovations from hyperscale data center operators can contribute to mitigating these challenges.
Yole Group will be part of the program with:
Emilie Jolivet
Business Line Director, More Moore activities
Thursday, April 25th
11:45am: Why chiplet will transform the semiconductor ecosystem from design to packaging?
Floor 1 – Pavilion 5, Room A
ABSTRACT:
In the last 5 years, we have witnessed worldwide efforts to develop innovative integration solutions that respond to the needs of power-efficient high-performance computing at cost compatible with the semiconductor industry.
Chiplet enable the integration of specialized components, such as high-speed interconnects, memory, and accelerators, leading to improved system-level performance and efficiency.
Fueled by the fast adoption of generative AI, 2.5D/3D architectures, the industry has geared up to chiplet adoption for years and has step by step removed the technical obstacles.
It’s not only about increasing computing performance in making CPU/GPU closer to the HBM memory through a silicon interposer, this has also been already available on the market for more than 10 years, but offering flexibility, modularity and re-use in design to achieve the most performant system.
This presentation will make a retrospective of the emergence of chiplet in datacenters and consumer markets and draw the outlines of its widest adoption in the coming years.
Emilie Jolivet
Business Line Director, More Moore activities
Emilie Jolivet is Business Line Director of the More Moore activities at Yole Group.
Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the memory, computing & software team.
In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside Yole Group.
Prior to Yole Group, after an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Then, Emilie worked at EV Group (Austria) as a business development manager in 3D & Advanced Packaging.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). She also graduated with an MBA from IAE Lyon.
