SMARTER SYSTEMS THROUGH HETEROGENEOUS INTEGRATION
The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore’s Law plateauing. Therefore, continued developments and innovation are essential to growing the business.
Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
Yole group will be part of these Industry Experts with:
Emilie JOLIVET,
Semiconductor, Memory and Computing Division Director
Yole Intelligence
Monday, June 26
Session 1: Market Briefing and Technical Roadmaps
3:50pm – 4:10pm: Chiplet Design and 2.5D Integration: Evolution or Revolution
ABSTRACT:
Chiplet design has found its way in the semiconductor industry, over the last years; and one of the enablers are the advanced packaging technologies based on stacking. Its emergence comes at the time when Moore ‘s law is slowing down and all the technical pillars and tools have been developed to enable chiplet as a choice in chip design. The industry has taken up the challenge to set up a whole supply chain from EDA tools to die bonding process.
The industry has geared up to chiplet adoption for years and has step by step removed the technical obstacles. Several commercial products based on chips partition and packaged using 2.5D solutions can now be found in the field, with this in mind, Yole has combined his strength in Processor and Advanced packaging to establish a model helping to define the sweet spot of chiplet versus monolithic SoC. Is partitioning the future of every chip?
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Emilie Jolivet
Business Line Director, More Moore activities
Emilie Jolivet is Business Line Director of the More Moore activities at Yole Group.
Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the memory, computing & software team.
In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside Yole Group.
Prior to Yole Group, after an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Then, Emilie worked at EV Group (Austria) as a business development manager in 3D & Advanced Packaging.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). She also graduated with an MBA from IAE Lyon.
