Tradeshows & Conferences
7th IEEE EDTM 2023 – ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCESign in for replay
Strengthen the global semiconductor research collaboration beyond the COVID-19 pandemic era
The 7th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2023) is a full four-day conference to be held during March 7-10, 2023 in Seoul. It aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss about any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training.
Yole Group will be part of the program with:
Yik Yee TAN, Semiconductor Packaging & Assembly Senior Market & Technology Analyst,
Yole Intelligence part of yole Group
Wednesday, March 8
Session: Subcommittee: Packaging and Heterogeneous Integration
03:40pm: Status of Advanced Packaging and IC Substrate
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).