ALD/ALE 2024

The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) and the 11th International Atomic Layer Etching Workshop (ALE 2024) are a three-day event dedicated to the latest advancements in the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.

Since its inception in 2001, the ALD conference has been a global platform for the exchange of ideas, expertise, and best practices among scientists from the United States, Europe, and Asia. This year’s conference promises to continue this tradition of excellence.

Join Yole Group on site for an event that promises to be both informative and inspiring where we are eager to share our latest developments and insights in this dynamic field.. Don’t miss the opportunity to connect with us and other experts in atomic layer deposition and etching.

ABSTRACT:
From many years, Atomic Layer Deposition (ALD) and Atomic Layer Etch (ALE) have enabled subsequent generations of logic and memory. In 2024, ALD and ALE is again indispensable to drive innovation across patterning approaches, architecture change for transistor (FinFET to Gate All Around) and memory (DRAM to 3D DRAM or 3D NAND layer increase) as well as improve the performance of specialty devices (CMOS Image Sensors, BCD Power Si devices, SiC devices, integrated RF devices) .
These advancements are enabled by ALD and ALE equipment vendors who provide complete solutions that consider precursors, substrates, and processing problematics. Their efforts generate a collective 2023 market size of 3.3USDB for thermal and plasma equipment, representing 13% of the total deposition Wafer Fab Equipment (WFE) market. With further ALD and ALE needs, we expect this number to grow to 4.9USDB in 2029 with a 4.9% CAGR23-29, outperforming the overall WFE.
Via the market research, we aim to lay out the landscape of the industrial ALD and ALE equipment providers worldwide and highlight their innovative solutions proposed, which lead to specific market shares. Moreover, we draw a market forecast driven by mentioned CapEx hungry devices. Finally, we breakdown the market size to different device applications, wafer size, thermal and plasma ALD technologies.