Tradeshows & Conferences

EIPC 2023 – WINTER CONFERENCE

IC substrate : key element of the Packaging industry

The EIPC Winter Conference, which is to be held over two days, will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, Doosan, KLA, ASS Luippold, Dyconex, Suss MicroTec, Resonac, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Electra Polymers, Notion Systems, SUSS MicroTec, Taiyo and Parachem. There will also be a Table Top area where several companies will present themselves during the breaks of the conference.

Yole Group will be part of the speakers to cover this topic:

Emilie JOLIVET,
Semiconductor, Memory and Computing Division Director

yole Intelligence part of Yole Group

Thursday, February 9
Session 1: Business Outlook and Energy Security
09:15am – 09:35am: IC substrate : key element of the Packaging industry

ABSTRACT:
Moore and More-than-Moore applications require various types of substrates to sustain their packaging technology needs. The high demand of electronics devices from personal devices to datacenters has led to an unprecedented shortage of advanced substrate during the pandemic period reshuffling the cards of the substrates industry. This presentation will share the status of the IC substrate business and technology innovation but also the status of the several investment projects in Capex.

Global Advanced Substrate market value is expected to grow at a rate of 11% CAGR from $15.8B in 2021 to $29.6B in 2027, mainly driven by the high demand in mobile & consumer, automotive & mobility, and telecom & infrastructure.

The IC substrate is mainly driven by AP, baseband for FC CSP and 5G, HPC, GPU, server, and automotive industry for FC BGA. The market value is expected to grow at a rate of 12% CAGR from 12.6B in 2021 to $24.3B in 2027.

Main substrate technology trends are to increase the complexity towards larger areas, more layers and finer pitches and L/S by adopting processes like SAP, mSAP or amSAP. SLP technology developments remained steady in the last years while embedded die technology is aiming to enable multiple die embedding to reach more applications.

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