ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE

EPTC has been established as an international electronics packaging conference and is the IEEE EPS
flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI.