Tradeshows & Conferences

EPIC TECHNOLOGY MEETING ON PHOTONIC INTEGRATION AND PACKAGING

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Illuminating the Future of Technology

The EPIC Meeting on Integrated Photonics at Fraunhofer IZM is a landmark event that brings together industry leaders, photonics experts, and end-users from around the globe to explore the dynamic field of integrated photonics. Hosted by the Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting is set to foster collaborative discussions and push the boundaries of integrated photonics technology and scalable packaging of photonic chips.

As the demand for faster, smaller, and more efficient electronic devices continues to rise, integrated photonics has emerged as a transformative technology with the potential to revolutionize various sectors, including telecommunications, data centers, healthcare, and sensing applications. Fraunhofer IZM, renowned for its pioneering research in microsystems and packaging technology, leads the way in advancing integrated photonics, delivering innovative solutions with unparalleled performance and reliability.

The EPIC Meeting serves as a central hub where industry pioneers, entrepreneurs, investors, researchers, and decision-makers converge to exchange knowledge, share experiences, and collaborate on the future of integrated photonics. With a focus on scalable packaging of photonic chips, participants will delve into cutting-edge advancements in chip-scale integration, heterogeneous integration, advanced packaging techniques, and novel manufacturing processes.

Don’t miss this opportunity to be part of a transformative event that shapes the future of photonics technology. Join Yole Group at the EPIC Meeting on Integrated Photonics and be at the forefront of innovation and collaboration in this rapidly evolving field.

Yole Group will be part of the program with:

Eric Mounier
Chief Analyst, Photonic & Sensing

Tuesday, June 4th
1:30 – 3:30pm: SESSION 1: Integrated Photonics in Volume: Global Perspectives on the Silicon Photonics Technology Enabling Terabit Capacities in Datacom

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