Tradeshows & Conferences
EUROPEAN PACKAGING, ASSEMBLY, AND TEST – WORKSHOP 2023Sign in for replay
Aiming at facilitating mutual engagement, the European Packaging, Assembly, and Test – Workshop 2023 will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts along the complete semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging eco-system in Europe.
Key topics presented
- European market and supply chain
- European OSAT industry capabilities
- Device and packaging manufacturers trends in challenging times
- Advocacy for the packaging, assembly, and test industry in Europe
- Reliability and quality of electronic devices and systems
Yole Group will be part of it with:
Technology & Market Analyst,
Semicondutor Computing and Memory Division
Yole Intelligence part of Yole Group
Wednesday, September 6
Status of the Advanced Packaging Business
The presentation will share the latest metrics of the Advanced Packaging market including the newest manufacturing capabilities being put in place worldwide with a focus on Europe. European governments are investing in chip manufacturing to strengthen its local supply chain; however, assembly and test capacity is needed to boost time-to-market and decrease overseas dependency. With a 9.1% growth expected for the next five years, advanced packaging has become a critical and effective strategy for improved performance, following the industry’s latest megatrends of AI, HPC and vehicle electrification.
Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the Manufacturing & Global Supply Chain activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.