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Aiming at facilitating mutual engagement, the European Packaging, Assembly, and Test – Workshop 2023 will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts along the complete semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging eco-system in Europe.

Key topics presented

  • European market and supply chain 
  • European OSAT industry capabilities  
  • Device and packaging manufacturers trends in challenging times 
  • Advocacy for the packaging, assembly, and test industry in Europe 
  • Reliability and quality of electronic devices and systems

Yole Group will be part of it with:

Gabriela Pereira
Technology & Market Analyst,
Semicondutor Computing and Memory Division

Yole Intelligence part of Yole Group

Wednesday, September 6
Status of the Advanced Packaging Business

The presentation will share the latest metrics of the Advanced Packaging market including the newest manufacturing capabilities being put in place worldwide with a focus on Europe. European governments are investing in chip manufacturing to strengthen its local supply chain; however, assembly and test capacity is needed to boost time-to-market and decrease overseas dependency. With a 9.1% growth expected for the next five years, advanced packaging has become a critical and effective strategy for improved performance, following the industry’s latest megatrends of AI, HPC and vehicle electrification.

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