EUROPEAN PACKAGING, ASSEMBLY, AND TEST – WORKSHOP 2023

Aiming at facilitating mutual engagement, the European Packaging, Assembly, and Test – Workshop 2023 will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts along the complete semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging eco-system in Europe.

Key topics presented

ABSTRACT
The presentation will share the latest metrics of the Advanced Packaging market including the newest manufacturing capabilities being put in place worldwide with a focus on Europe. European governments are investing in chip manufacturing to strengthen its local supply chain; however, assembly and test capacity is needed to boost time-to-market and decrease overseas dependency. With a 9.1% growth expected for the next five years, advanced packaging has become a critical and effective strategy for improved performance, following the industry’s latest megatrends of AI, HPC and vehicle electrification.