Tradeshows & Conferences
EPTC 2020
Market and Technology Trend for Advanced Packaging
On December 2nd, at 5pm SGT / 10am CET, Favier Shoo from Yole Développement will make a pesentation at the 2nd Electronics Packaging Technology Conference (EPTC) about the market and technology trend for advanced packaging.
He will explain how the Advanced Packaging market is expected to grow more than double its revenue from 20 B in 2014 to 42 B in 2025 and will present the latest market trends and technologies in Advanced Packaging.
Yole Développement will participate to the following:
Market and Technology Trends in Advanced Packaging
On December 2, 2020 at 10AM
Favier Shoo, Technology & Market Analyst, Semiconductor & Software, Yole Développement
Abstract : After 2 successive high growth years, the global semiconductor market declined 12% YoY to ~$412B in 2019. The decline is attributed to the cyclicality in product pricing, sluggish phone demand and global trade tension. In 2020, the semiconductor activity is witnessing another contraction due to the adverse impact of COVID-19 pandemic on the economy. Negative growth rate ( -3% YoY) is expected for year 2020. However, in 2021, the market expected to recover strongly and grow at 15% YoY.
Performance/power improvements at the escalating cost associated with Moore’s Law scaling had triggered semiconductor industry to focus on system-level scaling with Advanced Packaging solutions. Fueled by digital end-system demands for desired functional properties with cost-effective chip performance, Advanced Packaging has become increasingly vital to modern digital age technology. These key trends are paving the way for Advanced Packaging market opportunities. Two Advanced Packaging roadmaps are foreseen – scaling and functional.
Growing at 7% CAGR, Advanced Packaging market is expected to more than double its revenue from 20 B in 2014 to 42 B in 2025, compared to traditional packaging which will grow at 2.2% CAGR. Advanced Packaging is expected to grow more than 3 times quicker. This presentation will show the latest market trends and technologies in Advanced Packaging.