IMPACT 2021

IMPACT 2021 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on December 21-23 at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2021. For grasping the latest trend, the symposium this year highlights the theme “IMPACT on 5G+”. As the rapid growth of 5G coverage over the world, the 5G commercial network enables an array of revolutionary technologies such as loT, artificial intelligence (AI), edge computing and wearable devices. Given the foundational infrastructure is advancing along with technologies, 5G brings faster speed and connectivity to those using it.

IMPACT 2021 looks at the cutting-edge technological applications. With the increasing amount of data collected and leverage machine learning and artificial intelligence, may achieve a breakthrough in terms of high security and privacy-preservation, and increased efficiency.

IMPACT 2021 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference keeps collaborating with international organizations such as ICEP?JIEP from Japan, KAIST from South Korea, and iNEMI from USA in this year’s gathering.

Yole Développement will participate to the following:

December 22, 2021 – 13:20-15:20 (Taipei Time)

Favier Shoo, Team Lead Analyst, Packaging in Semiconductor, Memory & Computing Division, Yole Développement

Abstract : Fueled by digital end-system demands and technological innovation, Advanced Packaging technology options are increasingly rich and ground-breaking. Performance/power improvements at escalating cost associated with Moore’s Law scaling had triggered semiconductor industry to strategize system-level scaling with Advanced Packaging solutions instead of purely scaling FE advanced nodes. The industry is now diligently using advanced packaging technologies to put multiple advanced and/or mature chips in a single package. Together with 3D packaging this extends Moore’s Law at system-level. Times have changed. The total IC packaging market was worth $68B in 2020. Advanced Packaging was worth $30B and is expected to grow at CAGR2020-2026 of 7.7% to reach $47.5B in 2026. At the same time, traditional packaging market will grow at CAGR2020-2026 of 4.3% and total packaging market will grow at CAGR2020-2026 of 5.9% to $47.9B and $95.4B, respectively. Compared to traditional packaging which will grow at 3.2% CAGR2014-2026, Advanced Packaging  will grow more than 2 times quicker, with its CAGR2014-2026 of 7.4%. Two Advanced Packaging roadmaps are foreseen – scaling (going to sub10 nm nodes) and functional (staying above 20nm nodes). Both roadmaps hold more multi-die heterogeneous integration (SiP) and higher levels of package customization in the future. The possibilities of mix-and-match high-end and customized components can be unlocked with Advanced Packaging.

December 23, 2021 – 10:20-12:20 (Taipei Time

Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea

Abstract : After a slowdown in 2020 due to COVID-19, the global economy is set to expand by 5.6% in 2021 (its strongest post-recession pace in 80 years) and 4.3% in 2022. While demand by industry was uneven throughout the year due to global lockdowns, remote work and education, online entertainment, and shifts in consumer buying behavior, global semiconductor revenue grew by 6.8% YoY to reach $440 billion in 2020. The Advanced Packaging (AP) market was worth $30B in 2020 and is expected to grow at a CAGR2020-2026 of ~8% to reach $47.5B in 2026. The industry is seeking alternatives to design and manufacture the latest Systems on Chips (SoCs) using System in Package (SiP) and chiplet-based approaches by leveraging Advanced Packaging to mix both the latest and mature nodes. 2.5D/3D packaging is accelerating into new technical breakthroughs for 3D Interconnect Density (3D ID). 3D SoC – D2W and D2D hybrid bonding is viewed as the next technology breakthrough to achieve 10 ?m fine pitch. Regarded as a FE packaging technology, this enables system-level high-end performance with denser 3D IC stacking of 3D DRAM, heterogenous integrated packages and packaged partitioned SoC dies. Leading suppliers, especially TSMC, YMTC, Samsung and Intel, are all targeting this by providing cutting-edge hybrid bonding solutions. This is perhaps the true contact point between the semiconductor and packaging worlds. The possibilities of mix-and-match high-end and customized components can be unlocked under one key technology, hybrid bonding. LTE evolution has led to complex architecture in mobile phones, mainly due to carrier aggregation. Meanwhile, RF’s board area and available antenna space have been reduced, leading to a densification trend that sees more handset OEMs adopting power amplifier modules and implementing new techniques, i.e., antenna-sharing between LTE and WiFi. 5G added even more complexity requiring more densification in front-end modules to enable 5G sub-6GHz & mmWave band integration. RF system integration & miniaturization trends require innovation at various levels for 5G packaging in mobile. The presentation will focus on the advanced packaging technology trends with the focus on the D2D / D2W hybrid bonding and the 5G packaging market  and technology trends for smartphones covering various RF front-end modules to support 5G communication including antenna in package (AiP).