IMPACT 2021

IMPACT 2021 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on December 21-23 at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2021. For grasping the latest trend, the symposium this year highlights the theme “IMPACT on 5G+”. As the rapid growth of 5G coverage over the world, the 5G commercial network enables an array of revolutionary technologies such as loT, artificial intelligence (AI), edge computing and wearable devices. Given the foundational infrastructure is advancing along with technologies, 5G brings faster speed and connectivity to those using it.

IMPACT 2021 looks at the cutting-edge technological applications. With the increasing amount of data collected and leverage machine learning and artificial intelligence, may achieve a breakthrough in terms of high security and privacy-preservation, and increased efficiency.

IMPACT 2021 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference keeps collaborating with international organizations such as ICEP、JIEP from Japan, KAIST from South Korea, and iNEMI from USA in this year’s gathering.

Yole Développement will participate to the following:

December 22, 2021 – 13:20-15:20 (Taipei Time)

Favier Shoo, Team Lead Analyst, Packaging in Semiconductor, Memory & Computing Division, Yole Développement

Abstract : Coming soon

December 23, 2021 – 10:20-12:20 (Taipei Time

Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea

Abstract : Coming soon