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Ready, Set, Ramp?

The global semiconductor market is expected to reach an astounding $1 trillion by 2030.  As the industry endeavors to reach this milestone, it will encounter both headwinds and tailwinds. As the past few years have demonstrated, opportunities in the industry come hand-in-hand with new and unexpected challenges. From trade wars to a global pandemic to supply chain and economic disruptions, companies in all industries had to scramble to keep ahead of the curve. 

The Industry Strategy Symposium—ISS 2024 is designed to help the market players identify opportunities and tackle the challenges ahead and to see the whole picture—the business, economics, technology, workforce development, sustainability forces at play—so they can map out a strategy that minimizes risks and maximizes growth opportunities.

The range of expertise and insight at ISS is legendary: Speakers typically include industry leaders, economists, technologists, investors, and government officials—all bringing insight and unique perspectives to challenge your thinking and sharpen your focus. The speakers will be the drivers to help ramp up the industry’s path to $1T, how to fully capitalize on investments and opportunities, with emphasis on tailwinds and headwinds and how these can either accelerate or impede growth.

Yole Group will be part of program with:

Jean-Christophe ELOY,
CEO and President of Yole Group

Monday, January 8
Session 1—Economic Trends
11:35am: How Advanced Packaging and Chiplet Will Rule the World


In the last 5 years, we have witnessed worldwide efforts to develop innovative integration solutions that respond to the needs of power-efficient high-performance computing at a cost compatible with the semiconductor industry. Fueled by the fast adoption of generative AI and 2.5D/3D architectures, the industry has geared up to adopt chiplets for years and has, step by step, removed the technical obstacles.  
It’s not only about increasing computing performance by bringing the CPU/GPU closer to the HBM memory through a silicon interposer – this has been available in the market for more than 10 years already – but offers flexibility and design re-use to achieve the most performant systems. 
This presentation will be a retrospective of the emergence of chiplets in data centers and consumer markets and outline its potential for broad adoption in the coming years. 

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