INEMI PACKAGING TECH WEBINAR

This webinar in the iNEMI Tech Topic series focuses on the role of electronic design automation (EDA) tools in advanced semiconductor packaging. As the semiconductor industry moves rapidly towards heterogeneous integration, a new perspective has emerged. Development costs for design and manufacturing have soared to meet future scaling requirements essential for high-performance computing and AI acceleration.

Advanced semiconductor packaging, with the on-package integration of multiple chips, has become a key component in finding alternatives to transistor scaling. With the growing challenges associated with cutting-edge technologies, understanding the role of EDA tools in this context is vital for industry professionals.

Join Yole Group in this webinar for an immersive exploration of semiconductor packaging, and see how we’re shaping the future of this technology together.

ABSTRACT:
2.5D/3D packaging requiring significant innovation by the supply chain in technologies, processes, materials, and tools. There have been various options offered by different technologies provider to meet the higher density and lower L/S pitch requirement. In particular, the Artificial intelligence (AI) hype demands for higher transmission speeds and bandwidths, this will give huge opportunities for 2.5D/3D packaging adoption. This raises the interest of the bottleneck of 2.5D/3D packaging solution. What could be the next emerging packaging trend after 2.5D/3D? How the top player is addressing it?
Yole Group is well known for market and technology trends, including semiconductor manufacturing in advanced packaging. This presentation will give an overview of 2.5D/3D market trends and example of technology trends by few players. Last, we will discuss the challenges and innovations direction.