Leading the Way in Advanced Packaging Integration
Join Yole Group as we participate in the upcoming Advanced Packaging Integration Seminar organized by the Korea Packaging Integration Association (KPIA). We’re ready to engage with industry peers, share insights, and explore the latest trends shaping the packaging landscape. At the seminar, our team of experts will delve into critical topics such as emerging technologies, market trends, and innovative packaging strategies.
Yole Group will be part of the program with:
Bilal Hachemi
Technology & Market Analyst, Semiconductor Packaging
Rayane Mazari
Technology & Cost Analyst, Semiconductor Packaging
Wednesday, April 25th
10 – 10:50am: Advanced packaging market and technology trends
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Rayane Mazari
Technology & Cost Analyst, Computing
Rayane Mazari serves as a Technology & Cost Analyst, Computing, at Yole Group.
Rayane’s mission is to aid in the development of reverse engineering & costing reports. She works closely with the devices and laboratory team to set up significant physical & technology analyses of innovative IC and processor chips. She has a background in microelectronics.
Rayane holds a Master degree in Instrumentation & Microelectronics Engineering from Aix Marseille University.
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
