Spotlight on innovation
Embark on a journey of innovation at Photomask Japan 2024, the distinguished 30th International Symposium on Photomasks and NGL Masks in Japan! We are thrilled to be part of this dynamic gathering that brings together engineers and investigators from Japan, the USA, and across the globe.
The symposium serves as a platform for in-depth discussions on recent progress, applications, and future trends in the field. The conference program is thoughtfully designed, featuring an array of activities such as invited papers, contributed papers, poster sessions, and a rump session complete with engaging panel discussions.
Join Yole Group to be a part of this groundbreaking event, where industry leaders converge to share insights, exchange ideas, and shape the future of photomask technologies. Be a part of the conversation and witness the innovation unfold at Photomask Japan 2024!
Yole Group will be part of the program with:
Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Tuesday, April 16th
11am: Advanced Packaging & Photomask for Chiplet & Heterogeneous Integration
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Stefan Chitoraga
Business Development Manager, Semiconductor Packaging
Stefan Chitoraga is Business Development Manager, Semiconductor Packaging, at Yole Group.
He drives the expansion of Yole Group’s activities in Europe, particularly in France, South Europe and Middle East with a focus on advanced packaging platforms and processes, substrates, and PCBs within the company’s manufacturing and global supply chain activities. Stefan’s mission is to grow Yole Group’s business across the semiconductor ecosystem, strengthen sales efforts, and build long-term relationships with key accounts while ensuring their expectations are met.
Before taking on this role, Stefan contributed to the development of technology & market products and supported the delivery of custom consulting projects.
Prior to joining Yole Group, he worked as a package design engineer at Teledyne e2v for four years, overseeing ceramic package and glass lid development for image sensors, including mechanical design, routing, and electrical and thermal simulations. He also spent two years at STMicroelectronics, where he worked on new IC substrate design for organic packages targeting SerDes applications.
Stefan holds a Bachelor’s degree in electronics and computer science for industrial applications from Polytech Grenoble (France).
