Tradeshows & Conferences
PHOTOMASK JAPAN 2024
Spotlight on innovation
Embark on a journey of innovation at Photomask Japan 2024, the distinguished 30th International Symposium on Photomasks and NGL Masks in Japan! We are thrilled to be part of this dynamic gathering that brings together engineers and investigators from Japan, the USA, and across the globe.
The symposium serves as a platform for in-depth discussions on recent progress, applications, and future trends in the field. The conference program is thoughtfully designed, featuring an array of activities such as invited papers, contributed papers, poster sessions, and a rump session complete with engaging panel discussions.
Join Yole Group to be a part of this groundbreaking event, where industry leaders converge to share insights, exchange ideas, and shape the future of photomask technologies. Be a part of the conversation and witness the innovation unfold at Photomask Japan 2024!
Yole Group will be part of the program with:
Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Tuesday, April 16th
11am: Advanced Packaging & Photomask for Chiplet & Heterogeneous Integration
Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Stefan Chitoraga is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Within the Manufacturing & Global Supply Chain activities at Yole Group, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market products and custom consulting projects.
Prior to Yole Group, Stefan served as a package design engineer at Teledyne E2V for 4 years, where he oversaw the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations. Furthermore, he spent 2 years at STMicroelectronics where he developed a new IC Substrate design, for organic package for SerDes applications.
Stefan holds a Bachelor’s in electronics and computer science for industry applications from the Polytech Grenoble (France).