Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia
Geopolitical instability and ongoing trade tensions between the East and the West are just some of the aftershocks that the semiconductor industry is still reeling from, creating a ripple effect throughout the supply chain networks and ecosystem.
Consequently, the ongoing supply chain disruptions, the US CHIPS Act and the semiconductor alliance have now, more than ever, put a renewed focus on boosting the agility and resiliency of the electronics supply chain to respond to the evolving market forces.
As such, to necessitate a paradigm shift, there is a critical need for modernizing the supply chain strategy while pursuing two key objectives – having the agility to evolve swiftly and profitably by anticipating, initiating, and capitalizing on opportunities and having the resiliency to reorganize and deliver the core functions continually, despite the impact of external and/or internal shocks to the system.
Yole Group will be part of the program with:
Yik Yee TAN,
Senior Technology and Market Analyst – Advanced Packaging
Yole Intelligence part of Yole Group
May, Wednesday 24th
9:30am: Market and Technologies Trend in Advanced Packaging
May, Thursday 25th
9:30am: Global vehicle electrification trends and BEV opportunities in the developing world
Want to see the related content?
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).