Tradeshows & Conferences

The Era of Chiplets and Heterogeneous Integration

Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.

As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. How will we develop high speed and efficient interconnect protocols? What techniques do we need around post-packaging testing and the quality assurance of the assembled products? How will we monitor the reliability of the die-to-die (D2D) interconnects in mission mode? Emerging solutions are coming to light around how these challenges can be proactively addressed and solved, especially around visibility into high bandwidth D2D interfaces and advanced packaging. 

Stefan CHITORAGA, Technology & Market Analyst, at Yole Intelligence, part of Yole Group will be part of the speaker

Stefan will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.

More info and registration: HERE

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