Tradeshows & Conferences
The Era of Chiplets and Heterogeneous Integration
Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. How will we develop high speed and efficient interconnect protocols? What techniques do we need around post-packaging testing and the quality assurance of the assembled products? How will we monitor the reliability of the die-to-die (D2D) interconnects in mission mode? Emerging solutions are coming to light around how these challenges can be proactively addressed and solved, especially around visibility into high bandwidth D2D interfaces and advanced packaging.
Stefan CHITORAGA, Technology & Market Analyst, at Yole Intelligence, part of Yole Group will be part of the speaker
Stefan will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
More info and registration: HERE
Stefan Chitoraga
Business Development Manager, Semiconductor Packaging
Stefan Chitoraga is Business Development Manager, Semiconductor Packaging, at Yole Group.
He drives the expansion of Yole Group’s activities in Europe, particularly in France, South Europe and Middle East with a focus on advanced packaging platforms and processes, substrates, and PCBs within the company’s manufacturing and global supply chain activities. Stefan’s mission is to grow Yole Group’s business across the semiconductor ecosystem, strengthen sales efforts, and build long-term relationships with key accounts while ensuring their expectations are met.
Before taking on this role, Stefan contributed to the development of technology & market products and supported the delivery of custom consulting projects.
Prior to joining Yole Group, he worked as a package design engineer at Teledyne e2v for four years, overseeing ceramic package and glass lid development for image sensors, including mechanical design, routing, and electrical and thermal simulations. He also spent two years at STMicroelectronics, where he worked on new IC substrate design for organic packages targeting SerDes applications.
Stefan holds a Bachelor’s degree in electronics and computer science for industrial applications from Polytech Grenoble (France).