Tradeshows & Conferences
The Era of Chiplets and Heterogeneous Integration
Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. How will we develop high speed and efficient interconnect protocols? What techniques do we need around post-packaging testing and the quality assurance of the assembled products? How will we monitor the reliability of the die-to-die (D2D) interconnects in mission mode? Emerging solutions are coming to light around how these challenges can be proactively addressed and solved, especially around visibility into high bandwidth D2D interfaces and advanced packaging.
Stefan CHITORAGA, Technology & Market Analyst, at Yole Intelligence, part of Yole Group will be part of the speaker
Stefan will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
More info and registration: HERE
Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Stefan Chitoraga is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Within the Manufacturing & Global Supply Chain activities at Yole Group, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market products and custom consulting projects.
Prior to Yole Group, Stefan served as a package design engineer at Teledyne E2V for 4 years, where he oversaw the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations. Furthermore, he spent 2 years at STMicroelectronics where he developed a new IC Substrate design, for organic package for SerDes applications.
Stefan holds a Bachelor’s in electronics and computer science for industry applications from the Polytech Grenoble (France).