Webcasts
ANALYST THURSDAY 2024 : Generative AI Driving Advances in the High-Performance Computing and the Memory Markets
Register nowThe emergence and growth of AI models are transforming the computing and memory ecosystems, resulting in increasing demand for high-performance AI accelerators, memory, and enterprise-grade storage.
The digital era has seen rapid growth in generative artificial intelligence (AI), of which ChatGPT and DALL-E are just two of the many high-profile examples. These applications have evolved to a point where they provide their users with transformative tools for efficient and high-quality content creation, spurring a race among companies and industries looking to extract value from these revolutionary technologies. While innovations in software have played a prominent role in bringing these technologies to the forefront, the achievements would not be possible without significant developments in hardware, specifically in computing and memory. As AI models become more sophisticated and data-intensive, the demands on data center infrastructure, including the need for enhanced computational power and robust memory systems, are increasing exponentially. Generative AI is driving innovations in HPC and is fueling the high-bandwidth memory (HBM) market, pushing the boundaries of performance and efficiency. This trend has significantly impacted the demand for DRAM and NAND, necessitating higher capacities to meet the needs of AI workloads.
The webcast will examine established GPU and ASIC competitors for data center applications. It will feature a summarized teardown of NVIDIA GPUs and their evolution while highlighting the growing AI data center market and how it has impacted the global memory market, particularly the increasing need for high-bandwidth HBM memory. Beyond GPUs, specialized AI accelerators and neural processing units (NPUs) benefit equally from HBM technology; these systems also require high-performance NAND storage solutions to minimize costly downtimes.
2024 is a pivotal year for generative AI, which will drive substantial demand for advanced node processors and HBM.
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Thibault Grossi
Senior Technology & Market Analyst, Memory
Thibault GrossiI is a Senior Technology & Market analyst, Memory at Yole Group.
Thibault is in engaged with in-depth analysis of the dynamic memory market, and is in charge of the Yole Group’s NAND market research.
Prior to Yole Group, he worked at Schneider Electric as resident engineer in an EMS in Asia and then occupied different position within the electronic procurement organization ( PCBA, Software and semiconductor).
Semiconductor business has been his focus for the last 10 years.
First in Projects Procurement and then as Category Manager for Semiconductor and Display where he was in charge of procurement strategy on memory and analog. He led global negociations and interfaced Europe designs projects.
Thibault obtained in 2006 a master degree in electronic and computing science from Pierre and Marie Curie University in Paris.
Belinda Dube
Senior Technology & Cost Analyst, Memory
Belinda Dube is Senior Technology & Cost Analyst, Memory at Yole Group.
Belinda’s core expertise is memory technology, especially DRAM and 3D NAND flash memory. At the same time, she also investigates IC technologies as well as advanced packaging.
Belinda’s mission is to develop reverse engineering & costing products. She also works on custom projects, where she works closely with the laboratory team to set up significant physical & chemical analyses of innovative memory chips. Based on the results, Belinda identifies and analyzes the overall manufacturing process and all technical choices made by the memory makers. The objectives of these analyses are to understand the structure of the device, identify all materials used, and point out the link between functionality and technology selected by the memory company.
In addition, a significant portion of her mission is dedicated to a strategic technology watch, where her aim is to identify innovative memory chips and manufacturing processes. Based on her expertise, Belinda updates internal simulation tools and runs custom training sessions and demos with industrials.
Belinda attends many international trade shows & conferences where she collects valuable information and meets leading memory players. She regularly has an opportunity to reveal pertinent results during key onsite presentations and webcasts.
Prior to Yole Group, Belinda had the opportunity to work on several R&D projects dedicated to MEMS technologies and new substrates at INSA (Lyon, France).
Belinda holds a master’s degree in Instrumentation & Nanotechnology Engineering from INSA (France).
John Lorenz
Senior Technology & Market Analyst, Memory
John Lorenz is Senior Technology & Market Analyst, Memory at Yole Group.
John is in engaged with in-depth analysis of the dynamic memory market for the logic segment of advanced semiconductors, with a primary focus on processors. He oversees the Yole Group’s DRAM market research.
Prior to joining Yole Group, John held various engineering and strategic planning roles over 15 years at Micron Technology.
John has a Bachelor of Science degree in Mechanical Engineering from the University of Illinois Urbana-Champaign (USA), with a focus on MEMS devices.
Simone Bertolazzi, PhD
Principal Analyst, Memory
Simone Bertolazzi, PhD is Principal Analyst, Memory at Yole Group.
As member of the Yole Group’s Memory team, he contributes on a day-to-day basis to the analysis of markets and technologies, their related materials, device architectures and fabrication processes.
Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their opto-electronic device applications. He (co-) authored more than 20 papers in scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of two-dimensional materials and high-κ dielectrics. Simone earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Adrien Sanchez
Senior Technology & Market Analyst, Computing & Software
Adrien Sanchez is Senior Technology & Market Analyst, Computing & Software at Yole Group.
Adrien produces technology & market analyses covering computing hardware and software, AI, machine learning and neural networks.
Prior to Yole Group, he worked at AW Europe (Belgium), where he focused on image recognition & comprehension for ADAS. He also worked at ACOEM (France) on real-time sound classification using deep learning and edge computing.
Adrien graduated with a double degree at Grenoble Institute of Technology PHELMA (Grenoble INP Phelma, France) and Grenoble Ecole de Management (GEM, France), and he earned an MSc on AI at Heriot-Watt University (Edinburgh, UK).