Webcasts
ANALYST THURSDAY – The New Frontier: How Artificial Intelligence is Transforming Data Centers
Sign in for replayYole Group analysts will discuss the changes that the surge in AI workloads will drive for data center infrastructure.
As the demand for artificial intelligence (AI) applications continues to surge, the hardware landscape within data centers is undergoing a significant shift to accommodate these complex workloads. Join Yole Group for an insightful webinar where we delve into the transformative effect of AI on data center hardware, with a particular focus on processing, memory, photonics, and advanced packaging.
During this webinar, our expert speakers will explore the rise of specialized AI-driven hardware accelerators, such as GPUs, TPUs, and FPGAs, designed to handle the computational demands of AI workloads. We will also discuss the emergence of novel memory solutions to reduce data bottlenecks and facilitate faster AI processing and the advanced packaging and photonic technologies required to make everything work.
As we navigate these innovations, we will address the challenges faced by data centers in adopting AI-optimized hardware. Key topics include the need for scalable and adaptable infrastructure, the high costs of implementation, and the implications for power budgets. Furthermore, we will delve into the latest trends, opportunities, and potential future developments in data center hardware for AI applications.
This webinar will highlight:
- The role of GPUs, TPUs, and FPGAs in data center infrastructure and their impact on performance and efficiency.
- Novel memory technologies and architectures aimed at reducing data bottlenecks and facilitating faster AI processing.
- The integration of high-density packaging solutions for improved power delivery, thermal management, and overall system performance in AI-driven data centers.
- The potential of optical interconnects and photonic devices for enabling high-speed, energy-efficient communication within data center infrastructure.
- The obstacles faced by data centers in adopting AI-optimized hardware while exploring upcoming developments and potential opportunities in data center hardware for AI applications.
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Martin Vallo, PhD
Senior Technology & Market Analyst, Photonics
Martin Vallo, PhD is Senior Technology & Market Analyst, Photonics at Yole Group.
He is specialized in optical communication and semiconductor lasers within the Photonics & Sensing activities at Yole Group. With 12 years’ experience within semiconductor technology, Martin is involved today in the development of technology & market products as well as the production of custom consulting projects.
Prior his mission at Yole Group, he worked at CEA (Grenoble, France), with a mission focused on the epitaxial growth of InGaN/GaN core-shell nanowire LEDs by MOCVD and their characterization for highly flexible photonic devices.
Martin graduated from Academy of Sciences, Institute of Electrical Engineering (Slovakia) with an engineering degree in III-nitride semiconductors.
Belinda Dube
Senior Technology & Cost Analyst, Memory
Belinda Dube is Senior Technology & Cost Analyst, Memory at Yole Group.
Belinda’s core expertise is memory technology, especially DRAM and 3D NAND flash memory. At the same time, she also investigates IC technologies as well as advanced packaging.
Belinda’s mission is to develop reverse engineering & costing products. She also works on custom projects, where she works closely with the laboratory team to set up significant physical & chemical analyses of innovative memory chips. Based on the results, Belinda identifies and analyzes the overall manufacturing process and all technical choices made by the memory makers. The objectives of these analyses are to understand the structure of the device, identify all materials used, and point out the link between functionality and technology selected by the memory company.
In addition, a significant portion of her mission is dedicated to a strategic technology watch, where her aim is to identify innovative memory chips and manufacturing processes. Based on her expertise, Belinda updates internal simulation tools and runs custom training sessions and demos with industrials.
Belinda attends many international trade shows & conferences where she collects valuable information and meets leading memory players. She regularly has an opportunity to reveal pertinent results during key onsite presentations and webcasts.
Prior to Yole Group, Belinda had the opportunity to work on several R&D projects dedicated to MEMS technologies and new substrates at INSA (Lyon, France).
Belinda holds a master’s degree in Instrumentation & Nanotechnology Engineering from INSA (France).
John Lorenz
Senior Technology & Market Analyst, Memory
John Lorenz is Senior Technology & Market Analyst, Memory at Yole Group.
John is in engaged with in-depth analysis of the dynamic memory market for the logic segment of advanced semiconductors, with a primary focus on processors. He oversees the Yole Group’s DRAM market research.
Prior to joining Yole Group, John held various engineering and strategic planning roles over 15 years at Micron Technology.
John has a Bachelor of Science degree in Mechanical Engineering from the University of Illinois Urbana-Champaign (USA), with a focus on MEMS devices.
Mike Howard
VP of DRAM and Memory Research
As VP of DRAM and Memory Research, Mike Howard is a member of the Semiconductor, Memory & Computing division, at Yole Intelligence, part of Yole Group.
Mike’s mission at Yole is to deliver a comprehensive understanding of the entire memory and semiconductor landscape (with special emphasis on DRAM) via market updates and Market Monitors. Mike is also deeply involved in the business development of all memory activities. Mike is based in the US.
Mike has a deep understanding of the DRAM and memory markets with a valuable combination of industry and market research experience. For the decade prior to joining Yole, Mike was the Senior Director of DRAM and Memory Research at IHS. Before IHS, Mike worked at Micron Technology where he had roles in corporate development, marketing, and engineering.
Mike earned a Master of Business Administration at The Ohio State University (United-States), a Bachelor of Science in Chemical Engineering and a Bachelor of Arts in Finance at the University of Washington (Washington, United-States).
Stefan Chitoraga
Technology & Market Analyst, Semiconductor Packaging
Stefan Chitoraga is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Within the Manufacturing & Global Supply Chain activities at Yole Group, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market products and custom consulting projects.
Prior to Yole Group, Stefan served as a package design engineer at Teledyne E2V for 4 years, where he oversaw the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations. Furthermore, he spent 2 years at STMicroelectronics where he developed a new IC Substrate design, for organic package for SerDes applications.
Stefan holds a Bachelor’s in electronics and computer science for industry applications from the Polytech Grenoble (France).