ANALYST THURSDAY – CHINA’S SEMICONDUCTOR INDUSTRY RISES AS A GLOBAL CHALLENGERRegister now
driven by advancements in advanced node manufacturing, a strategic memory market, active participation in the SiC gold race, strategic emphasis on advanced packaging, and investments in cutting-edge manufacturing equipment.
In the last few decades, the Chinese semiconductor industry has undergone a remarkable transformation, evolving from a nascent player to a formidable challenger on the global stage. This journey can be attributed to several key factors, including advancements in advanced node manufacturing, an expanding memory market, the Silicon Carbide (SiC) gold race, and strategic investments in advanced packaging capacities and manufacturing equipment.
This Analyst Thursday Webinar will highlight Yole Group’s view on China semiconductor industry as well as hot topics that will shape future of this industry:
- Power SiC
> Electrification of China automotive park is skyrocketing, with more than 20% of vehicle produced based on BEV platform.
> Chinese players are gaining market share at the SiC wafer level, and significant capacity is planned in the coming five years, targeting more than 40% of the total capacity in 2027.
> Beijing and Shanghai are the two main regions developing SiC business. More than $1.5B has been invested into SiC in China over the last months.
> Automotive ADAS/AD processor market is rapidly growing, with a CAGR of around 20% and China is eager of it.
> Tesla FSD HW4, Apple A17, HiSilicon 9000s, advanced computing chip are providing incredible performance with advanced nodes, China wants to stay in the game.
> In a +180B dollar processor market, either in consumer, automotive or datacenter markets, China is heavily investing to reduce its dependence on foreign semiconductor technologies.
> Combined stand-alone NAND and DRAM sales to China were worth around $138B in 2022, corresponding to around 32% of overall NAND and DRAM sales worldwide.
> Chinese players are developing and adopting hybrid bonding interconnection technology as an alternative to dimensional scaling.
> DRAM-Logic Integration: logic die and DRAM die bonded together through copper-to-copper hybrid bonding to increase chip bandwidth.
- Semiconductor Packaging
> Top ten Chinese OSATs’ total revenues grew 8% from 2021 to 2022, from $11.4B to $12.2B.
> Chinese OSATs are mainly focusing on mid-end Advanced Packaging platforms and targeting high-end technologies for the future.
> Three major OSAT memory players are working with the two Chinese memory leaders to face headwinds due to the U.S. restrictions.
- Wafer Fab Equipment
> Large WFE revenue growth expected in the area where China invests: mature foundry, specialty and advanced packaging/OSATs.
> In terms of technology for >28 nm production, several WFE makers can already replace international once but production capacities are limited.
Technology & Cost Analyst
Ying-Wu Liu serves as a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.
Yik Yee Tan
Senior Market & Technology Analyst, Semiconductor Packaging & Assembly
Yik Yee Tan, PhD. is a Senior Technology & Market Analyst, Semiconductor Packaging & Assembly at Yole Intelligence, part of Yole Group (Yole), within the Semiconductor, Memory & Computing division.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects.
Prior to Yole, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
Yik Yee Tan holds a Ph.D. in Engineering Science from Multimedia University (MMU, Malaysia).
Senior Technology & Market Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence
Poshun Chiu is Senior Technology & Market Analyst specializing in Compound Semiconductor and Emerging Substrates at Yole Intelligence, part of Yole Group.
Poshun Chiu is Senior Technology & Market Analyst specializing in Compound Semiconductor and Emerging Substrates at Yole Intelligence, part of Yole Group. As a member of the Power Electronics & Wireless division at Yole, Poshun focuses on power, RF, and opto-electronics. He is engaged in the development of technology and market reports and is also involved in custom projects.
Poshun received an MSc degree in Microelectronics from National Cheng Kung University (TW) and an MBA from IESEG School of Management (FR).
Principal Technology & Market Analyst, Memory
Simone Bertolazzi, PhD. is a Principal Technology & Market Analyst at Yole Intelligence, part of Yole Group, working with the Semiconductor, Memory & Computing division.
Simone is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of memory technologies, their related materials and fabrication processes. He obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of two-dimensional materials and high-κ dielectrics.
Senior Technology & Market Analyst, Semiconductor Equipment, Subsystems, and Testing
Taguhi Yeghoyan, Ph.D., is a Senior Technology & Market Analyst in the Semiconductor Equipment, Subsystems, and Testing division at Yole Intelligence, part of Yole Group.
Taguhi tracks the evolution of the wafer fab equipment market. She produces yearly technology and market reports, quarterly market monitors, and custom projects.
Prior to Yole, she worked in European research centers and laboratories. Taguhi has authored or co-authored two patents and more than ten papers.
Taguhi holds a master’s degree and Ph.D. in Materials Science from the University of Lyon (France).
Technology & Market Analyst, Computing & Software
Adrien Sanchez is Computing & Software Technology Market Analyst, belongs to the Semiconductor, Memory & Computing division at Yole Intelligence, part of Yole Group.
In collaboration with his team, Adrien produces technology & market analyses covering computing hardware and software, AI, machine learning and neural networks. Adrien graduated with a double degree at Grenoble Institute of Technology PHELMA (Grenoble INP Phelma, France) and Grenoble Ecole de Management (GEM, France), and he earned an MSc on AI at Heriot-Watt University (Edinburgh, UK).