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ANALYST THURSDAY – CHINA’S SEMICONDUCTOR INDUSTRY RISES AS A GLOBAL CHALLENGER
Sign in for replaydriven by advancements in advanced node manufacturing, a strategic memory market, active participation in the SiC gold race, strategic emphasis on advanced packaging, and investments in cutting-edge manufacturing equipment.
In the last few decades, the Chinese semiconductor industry has undergone a remarkable transformation, evolving from a nascent player to a formidable challenger on the global stage. This journey can be attributed to several key factors, including advancements in advanced node manufacturing, an expanding memory market, the Silicon Carbide (SiC) gold race, and strategic investments in advanced packaging capacities and manufacturing equipment.
This Analyst Thursday Webinar will highlight Yole Group’s view on China semiconductor industry as well as hot topics that will shape future of this industry:
- Power SiC
> Electrification of China automotive park is skyrocketing, with more than 20% of vehicle produced based on BEV platform.
> Chinese players are gaining market share at the SiC wafer level, and significant capacity is planned in the coming five years, targeting more than 40% of the total capacity in 2027.
> Beijing and Shanghai are the two main regions developing SiC business. More than $1.5B has been invested into SiC in China over the last months.
- Computing
> Automotive ADAS/AD processor market is rapidly growing, with a CAGR of around 20% and China is eager of it.
> Tesla FSD HW4, Apple A17, HiSilicon 9000s, advanced computing chip are providing incredible performance with advanced nodes, China wants to stay in the game.
> In a +180B dollar processor market, either in consumer, automotive or datacenter markets, China is heavily investing to reduce its dependence on foreign semiconductor technologies.
- Memory
> Combined stand-alone NAND and DRAM sales to China were worth around $138B in 2022, corresponding to around 32% of overall NAND and DRAM sales worldwide.
> Chinese players are developing and adopting hybrid bonding interconnection technology as an alternative to dimensional scaling.
> DRAM-Logic Integration: logic die and DRAM die bonded together through copper-to-copper hybrid bonding to increase chip bandwidth.
- Semiconductor Packaging
> Top ten Chinese OSATs’ total revenues grew 8% from 2021 to 2022, from $11.4B to $12.2B.
> Chinese OSATs are mainly focusing on mid-end Advanced Packaging platforms and targeting high-end technologies for the future.
> Three major OSAT memory players are working with the two Chinese memory leaders to face headwinds due to the U.S. restrictions.
- Wafer Fab Equipment
> Large WFE revenue growth expected in the area where China invests: mature foundry, specialty and advanced packaging/OSATs.
> In terms of technology for >28 nm production, several WFE makers can already replace international once but production capacities are limited.
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Ying-Wu Liu
Technology & Cost Analyst, Computing & Software
Ying-Wu Liu is Technology & Cost Analyst, Computing & Software at Yole Group.
Ying-Wu ’s core expertise is Integrated Circuits technologies. With solid expertise in physical and electronical analysis of devices and experiences in wafer manufacturing and technical supports with international clients, Ying’s mission is to develop reverse engineering & costing analyses.
She works closely with different laboratories to set up significant physical analyses of innovative IC chips. Based on the results, Ying identifies and analyzes the overall manufacturing process and all technical choices made by the ICs makers to understand the structure of the device and point out the link between cost and technology.
Prior to Yole Group, Ying worked as Technical Support Manager at KEOLABS, in France and spent nearly 4-years as an integration/R&D engineer in semiconductor foundries in Taiwan.
Ying holds a master’s degree in Theoretical Physics from the National Tsing Hua University (Taiwan), and a master in Integration, Security and Trust in Embedded systems from the Grenoble INP, ESISAR (France).
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Poshun Chiu
Senior Technology & Market Analyst, Semiconductor Substrates & Materials
Poshun Chiu is Senior Technology & Market Analyst, Semiconductor Substrates & Materials at Yole Group.
Poshun is engaged in the development of technology and market products and is involved in custom projects.
Before joining Yole Group, Poshun had 9 years’ experience in R&D and product management at Epistar (TW & CHN). He is the author or co-author of more than 10 patents in solid-state-lighting. Poshun was also engaged in the development and evaluation of novel applications of process technology and components based on relevant semiconductor material systems.
Poshun received an MSc degree in microelectronics from National Cheng Kung University (TW) and an MBA from IESEG School of Management (FR).
Simone Bertolazzi, PhD
Principal Analyst, Memory
Simone Bertolazzi, PhD is Principal Analyst, Memory at Yole Group.
As member of the Yole Group’s Memory team, he contributes on a day-to-day basis to the analysis of markets and technologies, their related materials, device architectures and fabrication processes.
Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their opto-electronic device applications. He (co-) authored more than 20 papers in scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of two-dimensional materials and high-κ dielectrics. Simone earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Taguhi Yeghoyan, PhD
Senior Technology & Market Analyst, Semiconductor Equipment
Taguhi Yeghoyan, PhD is Senior Technology & Market Analyst, Semiconductor Equipment at Yole Group.
Taguhi’s mission is to daily follow the semiconductor industry and its evolution. Based on her expertise in this field, especially on the semiconductor supply chain (processes, materials, equipment, and related applications), Taguhi produces technology & market products and is engaged in relevant custom projects.
Prior to Yole Group, she worked in world-class European research centers and laboratories, including imec (Belgium), LMI (Lyon, France) and LTM at CEA Leti (Grenoble, France). All along her past experiences, Taguhi has authored or co-authored two patents and more than ten papers.
She has graduated from Wroclaw University of Technology (Poland) and University of Lyon (France). Taguhi also completed her PhD in material science from the University of Lyon (France).
Adrien Sanchez
Senior Technology & Market Analyst, Computing & Software
Adrien Sanchez is Senior Technology & Market Analyst, Computing & Software at Yole Group.
Adrien produces technology & market analyses covering computing hardware and software, AI, machine learning and neural networks.
Prior to Yole Group, he worked at AW Europe (Belgium), where he focused on image recognition & comprehension for ADAS. He also worked at ACOEM (France) on real-time sound classification using deep learning and edge computing.
Adrien graduated with a double degree at Grenoble Institute of Technology PHELMA (Grenoble INP Phelma, France) and Grenoble Ecole de Management (GEM, France), and he earned an MSc on AI at Heriot-Watt University (Edinburgh, UK).