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Components for 3D Sensing Revolution
July 10 at 5 PM CEST – 8 AM PDT
Yole Développement proposes to share its analysis of the situation on July 10th, 2018 with a dedicated webcast!
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3D sensing is setting a new paradigm for human to device interaction in the smartphone space. This newly embedded technology is built around a complex set of sub-components assembled to provide scene understanding beyond the traditional 2D video. Depth perception in this market is a difficult task knowing the constrained cost, space and power considerations.
Join the Yole webcast to discuss the key challenges of underlying sub- components for 3D sensing in the consumer space with a specific focus on illumination VCSELs.
Pierre Cambou joined the imaging industry in 1999. Following an engineering degree from Université de Technologie de Compiègne in parallel to a master of science from Virginia Tech in 1998, as well as graduating from Grenoble Ecole de Management’s MBA, Cambou took several positions at Thomson TCS, which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded Vence Innovation, now called Irlynx, in order to bring to market a disruptive man-to-machine interaction technology. He joined market research and strategy consulting company Yole Développement (Yole) as Principal Analyst, Technology & Market, Imaging in 2014, within the Photonics, Sensing & Display division.
As part of the Photonics, Sensing & Display division at Yole Développement (Yole), Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO – France).
Dr Stéphane Elisabeth has joined System Plus Consulting team to provide his deep knowledge in RF application, materials characterizations and Electronics systems. He is in charge of Imaging, RF and Packaging projects. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.
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