Photonics, Power and RF Packaging Forum 2022 – powered by Yole Group and CITCRegister now
To accommodate to your end of year busy schedule, Yole Group and Chip Integration Technology Center – CITC, are glad to inform you that this new edition will be fully ONLINE.
POWER, RF, AND PHOTONICS MARKET DEMANDS CREATE A STRONG INFLECTION POINT FOR PACKAGING ECOSYSTEM
Yole Group & CITC announces a joint forum and discussion on packaging for photonic, power, and RF devices, all of which are crucial for the semiconductor ecosystem. Indeed, regional demand and a reliable supply chain necessitate close collaboration of all packaging players, i.e., from materials and equipment vendors to device manufacturers and packaging facilities.
The packaging approaches for photonic, RF, and power devices & modules are very varied and need to respond to a rapid evolution of device front-end & module advancement.
For this reason, all packaging approaches are used, from traditional discrete and module packaging using wire bond interconnects to more advanced Ag sintering or Cu sintering die attach technologies to advanced packaging, comprising Flip-Chip, System-in-Package, Fan-In, Fan-out, Embedded Die, 2.5D (glass and silicon interposer) and 3D stacking.
Advanced Packaging technology, including the entire ecosystem supporting it, is one of the key factors supporting semiconductor industry growth.
Yole Group and CITC welcome you to a discussion with relevant players in the packaging field
Feel free to contact us firstname.lastname@example.org
09:00 AM – Introduction by Yole Group & CITC
9:30 AM – Photonics Packaging of PICs from research to pilot scale manufacturing
This talk will present some of the outstanding packaging challenges for PICs and what new technologies are being developed to solve them.
Padraic MORRISSEY, Pilot Line Programme Manager, TYNDALL NATIONAL INSTITUTE
10:00 AM – Hybrid Photonic Integration for Communication, Quantum, and Sensing
Hybrid Photonic Integration allows for combining the best material for each optical function. Challenges in assembly and packaging are solvable.
Martin SCHELL, Executive Director, FRAUNHOFER HEINRICH HERTZ INSTITUTE
10:30 AM – Quantum Enabling Photonic Packaging
Quantum enabling photonic component packaging requirements often diverge from those of traditional semiconductor packaging. What explore the solutions.
Andrew ROBERTSON, CTO, BAY PHOTONICS
11:00 AM – Coffee Break
11:15 AM Micro Transfer Printing for Compound Semiconductor 3DHI Microsystems
Micro transfer printing enables disruptive 3-dimensional compound semiconductor and silicon heterogeneous integration for photonics, power and RF applications.
Bob CONNER, VP New Application Business Development, X-Celeprint
11:45 AM High accuracy placement for Photonics and RF applications
High accuracy placement is the key for Photonics and RF packaging in the next decade and beyond.
Daniel LIESKE, Senior Expert Advanced Packaging, AEMtec
12:15 – Lunch Break
1:30 PM New JSR Packaging materials for 5G and RF applications
High density routing and low loss design are the key for future advanced Packaging
Jérôme SERRAND, Technical Packaging Manager, JSR
2:00 PM Making mm-Wave and sub-THz Over-the-Air Characterization a Reality
For highly integrated mm-Wave devices, we need the right set of complementary tools and techniques to ensure a smooth path from design to validation.
Sander BRONCKERS, Assistant professor // Co-founder, ANTENNEX
Ad REINERS, Education and research // Co-founder, ANTENNEX
2:30 PM RF SIP packaging markets trends
Gabriela PEREIRA, Technology & Market Analyst, Yole Intelligence part of Yole Group
3:00 PM – Coffee Break
3:15 PM Packaging and integration of advanced power semiconductors
Methods, materials, and technologies to overcome the EMI, thermal, and insulation limitations of wide- and ultra-wide-bandgap power semiconductors.
Christina DIMARINO, Assistant Professor, VIRGINIA TECH
3:45 PM Accelerating SiC power electronics commercialization
The key aspects of SiC technology and outline efforts to overcome the last major barriers to mass commercialization.
Victor VELIADIS, Executie Director & CTO, POWER AMERICA
4:15 PM Reverse Technology and Cost for Power Devices Packaging
Technology and Cost Overview Of Power Packaging for Discretes and Modules
Amine ALLOUCHE Technology & Cost Analyst Yole SystemPlus
4:45 PM Conclusion
Online registration: FREE
It includes: online conference and proceedings
Education and research
Ad Reniers received the Ph.D. degree in electrical engineering from the Eindhoven University of Technology (TU/e), in 2022. In the past he worked at TNO on topics like antenna miniaturization, material characterization and antenna measurement. Since 2009 he is affiliated with the electromagnetics group of the TU/e. He is currently researching uncertainties in antenna measurements and material characterization in the millimeter wave frequency range.
Andrew Robertson. has a PhD in Laser Physics & Nonlinear Optics and a BSc in Laser Physics & Optoelectronics, both from the University of Strathclyde, Glasgow. Andrew has over 25 years of experience in successful commercial technology development & exploitation within photonics. In 2002, he was one of the founders of SIFAM Fibre Optics which was acquired by Gooch & Housego (G&H) in 2007. Andrew held key senior engineering management roles within G&H and was a member of the Senior Management Team, becoming Senior Vice President and latterly focusing on Strategic Mergers and Acquisitions. Since 2020, Andrew has been with Bay Photonics and as CTO, has led the development of photonics based semiconductor packaging critical for enabling photonic driven Quantum Technology. Bay Photonics are currently supplying packaged SPADs and packaged quantum photonic integrated circuits (Q-PICs) for quantum computing, secure quantum communications, and quantum LIDAR imaging systems.
Co-founder - ANTENNEX BV
Sander Bronckers received the M.Sc. degree (cum laude) in electrical engineering from Eindhoven University of Technology (TU/e), The Netherlands, in 2015. In 2018, he was a visiting researcher at NIST (Boulder, Colorado) on antenna measurements in reverberation chambers. He obtained the Ph.D. degree (cum laude) in electrical engineering in 2019, within the electromagnetics group at TU/e, on design and measurement techniques for next-generation integrated antennas. Since 2019, he is an assistant professor on Metrology for Antennas and Wireless Systems at TU/e. In addition, he chairs the ultra-high data rate track in the Centre for Wireless Technology Eindhoven (CWT/e). In 2020, he co-founded AntenneX BV, a start-up focusing on high-frequency wireless characterization. His research interests include antenna (system) measurements in reverberation and hybrid chambers, channel sounding and emulation, and RF material characterization.
Technical Packaging Manager - JSR
Packaging Technical Manager. Jerome joined JSR in 2002, he is located near Grenoble the French Silicon Valley from where he can give full technical support to many different key customers in Europe. Keeping close contact with the R&D department in Japan and Belgium, he manages and supports several key Packaging projects for all European customers.
Executie Director & CTO - POWER AMERICA
Dr. Victor Veliadis is Executive Director & CTO of PowerAmerica, a member-driven consortium of industry, universities, and national labs accelerating the commercialization of energy efficient SiC and GaN power semiconductor technologies. At PowerAmerica, he has managed a budget of $150 million that he strategically allocated to over 200 industrial and University projects to accelerate SiC/GaN semiconductor and power electronics manufacturing, workforce development, and job creation. His PowerAmerica educational activities have trained 420 full-time students in collaborative industry/University WBG projects, and engaged over 4300 attendees in tutorials, short courses, and webinars.
Dr. Veliadis is an ECE Professor at NCSU, an IEEE Fellow, and an ΙΕΕΕ EDS Distinguished Lecturer. He has 27 issued U.S. patents, 6 book chapters, and over 150 peer-reviewed publications to his credit. Dr. Veliadis has also given over 100 keynote/tutorial/invited presentations including at ICSCRM, ISPSD, APEC, ECCE, and WiPDA.
Prior to entering academia and taking an executive position at Power America in 2016, Dr. Veliadis spent 21 years in the semiconductor industry where his work included design, fabrication, and testing of SiC devices, GaN devices for military radar amplifiers, and financial and operations management of a commercial semiconductor fab. He has a Ph.D. degree in Electrical Engineering from John Hopkins University (1995).
Assistant Professor - VIRGINIA TECH
Christina DiMarino is an assistant professor in the Bradley Department of Electrical and Computer Engineering at Virginia Tech, and faculty in the Center for Power Electronics Systems (CPES). She earned her M.S. and Ph.D. degrees in electrical engineering from Virginia Tech in 2014 and 2018, respectively. She was a Webber Fellow from 2012 to 2015, and a Rolls-Royce Graduate Fellow from 2016 to 2017. Her research interests include power electronics packaging and integration of advanced power semiconductor devices. Dr. DiMarino is a Member of the IEEE Power Electronics Society (PELS), where she currently serves as a Member-at-Large for the PELS Administrative Committee, Vice Chair for the PELS Technical Committee on Power Components, Integration, and Power ICs, and is a member of the PELS Women in Engineering Steering Committee.
VP New Application Business Development - X-Celeprint
Bob Conner is VP of New Application Business Development at X-Celeprint. Previously, he was CEO of Sarda Technologies and Symmorphix. Bob has held VP positions at Semprius, Nextreme and Cirrus Logic and worked for Applied Materials, Intel and GE. Bob earned his MBA at University of Chicago and BSME at Duke University.
Executive Director - FRAUNHOFER HEINRICH HERTZ INSTITUTE
Martin Schell received the Dipl.Phys. degree from RWTH Aachen University, Aachen, Germany, in 1989 and the Dr.rer.nat. degree from the Technical University of Berlin, Germany, in 1993.
In 1995, he was Visiting Researcher at the University of Tokyo, Tokyo, Japan.
From 1996 to 2000, he was Management Consultant at The Boston Consulting Group.
From 2000 to 2005, he was Product Line Manager, and then Head of Production and Procurement, at Infineon Fiber Optics, Berlin.
He currently is Director of the Fraunhofer Heinrich Hertz Institute, Berlin and Professor for optic and optoelectronic integration with the Technical University of Berlin. He served as a board member of the European Photonics Industry Consortium from 2015 to 2021.
He is Chairman of the Competence Network Optical Technologies Berlin/Brandenburg (OptecBB), and Member of the Photonics21 Board of Stakeholders. His research interests include Photonic Integrated Circuits for communication, sensing, and quantum applications
Pilot Line Programme Manager - TYNDALL NATIONAL INSTITUTE
Padraic Morrissey is Technology Manager of the PIXAPP Pilot Line for Photonic Packaging and Assembly. His research interests focus on the development of standardized photonic packaging technologies leading to new optical and electrical packaging schemes for Si and InP based photonic systems. He has a demonstrated history of leading and managing photonic technology research across large, multi-partner EU projects and industrial engagements. He received his BSc. in Physics from University College Cork (UCC), Ireland in 2009. In 2014, he received is Ph.D in Physics from the Tyndall National Institute with a thesis entitled “Photonic Integrated Circuits for the Generation of Coherent Optical Signals”.
Senior Expert Advanced Packaging - AEMtec
Daniel Lieske is Senior Expert for Advanced Packaging at AEMtec. He supports product development and production teams and advises the sales for new customer projects and technology development at AEMtec. He holds a diploma in microelectronics and microsystems from the Brandenburg University of Technology in Cottbus.
Mr. Lieske worked as process engineer at Infineon Dresden and Qimonda in the Backend and was responsible for the development, production and process transfer to volume sites of Multi- Chip Modules (MCM). The last 11 years at AEMtec he was in charge of process development for wafer level solder ball attach, printing technologies, solder reflow and failure analysis.
Technology & Cost Analyst
Amine Allouche serves as a Technology & Cost Analyst, Power Electronics, at Yole SystemPlus, part of Yole Group.
Technology & Market Analyst
Gabriela Pereira is a Technology & Market Analyst in the Packaging team within the Semiconductor, Memory and Computing Division at Yole Intelligence, Yole Group (Yole).
Gabriela is focused on advanced packaging platforms.
Prior to Yole, Gabriela worked as an R&D Engineer at Amkor Technology, where she collaborated on several package development projects.
Gabriela holds a master’s degree in Metallurgical and Materials Engineering from the University of Porto (Portugal).