Photonics, Power and RF Packaging Forum 2022 – powered by Yole Group and CITC

Ad Reniers received the Ph.D. degree in electrical engineering from the Eindhoven University of Technology (TU/e), in 2022. In the past he worked at TNO on topics like antenna miniaturization, material characterization and antenna measurement. Since 2009 he is affiliated with the electromagnetics group of the TU/e. He is currently researching uncertainties in antenna measurements and material characterization in the millimeter wave frequency range.

Andrew Robertson. has a PhD in Laser Physics & Nonlinear Optics and a BSc in Laser Physics & Optoelectronics, both from the University of Strathclyde, Glasgow. Andrew has over 25 years of experience in successful commercial technology development & exploitation within photonics. In 2002, he was one of the founders of SIFAM Fibre Optics which was acquired by Gooch & Housego (G&H) in 2007. Andrew held key senior engineering management roles within G&H and was a member of the Senior Management Team, becoming Senior Vice President and latterly focusing on Strategic Mergers and Acquisitions. Since 2020, Andrew has been with Bay Photonics and as CTO, has led the development of photonics based semiconductor packaging critical for enabling photonic driven Quantum Technology. Bay Photonics are currently supplying packaged SPADs and packaged quantum photonic integrated circuits (Q-PICs) for quantum computing, secure quantum communications, and quantum LIDAR imaging systems.

Sander Bronckers received the M.Sc. degree (cum laude) in electrical engineering from Eindhoven University of Technology (TU/e), The Netherlands, in 2015. In 2018, he was a visiting researcher at NIST (Boulder, Colorado) on antenna measurements in reverberation chambers. He obtained the Ph.D. degree (cum laude) in electrical engineering in 2019, within the electromagnetics group at TU/e, on design and measurement techniques for next-generation integrated antennas. Since 2019, he is an assistant professor on Metrology for Antennas and Wireless Systems at TU/e. In addition, he chairs the ultra-high data rate track in the Centre for Wireless Technology Eindhoven (CWT/e). In 2020, he co-founded AntenneX BV, a start-up focusing on high-frequency wireless characterization. His research interests include antenna (system) measurements in reverberation and hybrid chambers, channel sounding and emulation, and RF material characterization.

Packaging Technical Manager. Jerome joined JSR in 2002, he is located near Grenoble the French Silicon Valley from where he can give full technical support to many different key customers in Europe. Keeping close contact with the R&D department in Japan and Belgium, he manages and supports several key Packaging projects for all European customers.

Dr. Victor Veliadis is Executive Director & CTO of PowerAmerica, a member-driven consortium of industry, universities, and national labs accelerating the commercialization of energy efficient SiC and GaN power semiconductor technologies. At PowerAmerica, he has managed a budget of $150 million that he strategically allocated to over 200 industrial and University projects to accelerate SiC/GaN semiconductor and power electronics manufacturing, workforce development, and job creation. His PowerAmerica educational activities have trained 420 full-time students in collaborative industry/University WBG projects, and engaged over 4300 attendees in tutorials, short courses, and webinars.

Dr. Veliadis is an ECE Professor at NCSU, an IEEE Fellow, and an ΙΕΕΕ EDS Distinguished Lecturer. He has 27 issued U.S. patents, 6 book chapters, and over 150 peer-reviewed publications to his credit. Dr. Veliadis has also given over 100 keynote/tutorial/invited presentations including at ICSCRM, ISPSD, APEC, ECCE, and WiPDA.

Prior to entering academia and taking an executive position at Power America in 2016, Dr. Veliadis spent 21 years in the semiconductor industry where his work included design, fabrication, and testing of SiC devices, GaN devices for military radar amplifiers, and financial and operations management of a commercial semiconductor fab. He has a Ph.D. degree in Electrical Engineering from John Hopkins University (1995).

Christina DiMarino is an assistant professor in the Bradley Department of Electrical and Computer Engineering at Virginia Tech, and faculty in the Center for Power Electronics Systems (CPES). She earned her M.S. and Ph.D. degrees in electrical engineering from Virginia Tech in 2014 and 2018, respectively. She was a Webber Fellow from 2012 to 2015, and a Rolls-Royce Graduate Fellow from 2016 to 2017. Her research interests include power electronics packaging and integration of advanced power semiconductor devices. Dr. DiMarino is a Member of the IEEE Power Electronics Society (PELS), where she currently serves as a Member-at-Large for the PELS Administrative Committee, Vice Chair for the PELS Technical Committee on Power Components, Integration, and Power ICs, and is a member of the PELS Women in Engineering Steering Committee.

Bob Conner is VP of New Application Business Development at X-Celeprint. Previously, he was CEO of Sarda Technologies and Symmorphix. Bob has held VP positions at Semprius, Nextreme and Cirrus Logic and worked for Applied Materials, Intel and GE. Bob earned his MBA at University of Chicago and BSME at Duke University.

Martin Schell received the Dipl.Phys. degree from RWTH Aachen University, Aachen, Germany, in 1989 and the Dr.rer.nat. degree from the Technical University of Berlin, Germany, in 1993.

In 1995, he was Visiting Researcher at the University of Tokyo, Tokyo, Japan.
From 1996 to 2000, he was Management Consultant at The Boston Consulting Group.
From 2000 to 2005, he was Product Line Manager, and then Head of Production and Procurement, at Infineon Fiber Optics, Berlin.
He currently is Director of the Fraunhofer Heinrich Hertz Institute, Berlin and Professor for optic and optoelectronic integration with the Technical University of Berlin. He served as a board member of the European Photonics Industry Consortium from 2015 to 2021.
He is Chairman of the Competence Network Optical Technologies Berlin/Brandenburg (OptecBB), and Member of the Photonics21 Board of Stakeholders. His research interests include Photonic Integrated Circuits for communication, sensing, and quantum applications

Padraic Morrissey is Technology Manager of the PIXAPP Pilot Line for Photonic Packaging and Assembly. His research interests focus on the development of standardized photonic packaging technologies leading to new optical and electrical packaging schemes for Si and InP based photonic systems. He has a demonstrated history of leading and managing photonic technology research across large, multi-partner EU projects and industrial engagements. He received his BSc. in Physics from University College Cork (UCC), Ireland in 2009. In 2014, he received is Ph.D in Physics from the Tyndall National Institute with a thesis entitled “Photonic Integrated Circuits for the Generation of Coherent Optical Signals”.

Daniel Lieske is Senior Expert for Advanced Packaging at AEMtec. He supports product development and production teams and advises the sales for new customer projects and technology development at AEMtec. He holds a diploma in microelectronics and microsystems from the Brandenburg University of Technology in Cottbus.

Mr. Lieske worked as process engineer at Infineon Dresden and Qimonda in the Backend and was responsible for the development, production and process transfer to volume sites of Multi- Chip Modules (MCM). The last 11 years at AEMtec he was in charge of process development for wafer level solder ball attach, printing technologies, solder reflow and failure analysis.

Gabriela is focused on advanced packaging platforms.
Prior to Yole, Gabriela worked as an R&D Engineer at Amkor Technology, where she collaborated on several package development projects.
Gabriela holds a master’s degree in Metallurgical and Materials Engineering from the University of Porto (Portugal).