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Photonics, Power and RF Packaging Forum 2022 – powered by Yole Group and CITC

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To accommodate to your end of year busy schedule, Yole Group and Chip Integration Technology Center – CITC, are glad to inform you that this new edition will be fully ONLINE.

POWER, RF, AND PHOTONICS MARKET DEMANDS CREATE A STRONG INFLECTION POINT FOR PACKAGING ECOSYSTEM

Yole Group & CITC announces a joint forum and discussion on packaging for photonic, power, and RF devices, all of which are crucial for the semiconductor ecosystem. Indeed, regional demand and a reliable supply chain necessitate close collaboration of all packaging players, i.e., from materials and equipment vendors to device manufacturers and packaging facilities.

The packaging approaches for photonic, RF, and power devices & modules are very varied and need to respond to a rapid evolution of device front-end & module advancement.
For this reason, all packaging approaches are used, from traditional discrete and module packaging using wire bond interconnects to more advanced Ag sintering or Cu sintering die attach technologies to advanced packaging, comprising Flip-Chip, System-in-Package, Fan-In, Fan-out, Embedded Die, 2.5D (glass and silicon interposer) and 3D stacking.
Advanced Packaging technology, including the entire ecosystem supporting it, is one of the key factors supporting semiconductor industry growth.

Yole Group and CITC welcome you to a discussion with relevant players in the packaging field

Feel free to contact us events@yolegroup.com

FULL PROGRAM:

09:00 AM – Introduction by Yole Group & CITC

PHOTONICS SESSION
9:30 AM – Photonics Packaging of PICs from research to pilot scale manufacturing
This talk will present some of the outstanding packaging challenges for PICs and what new technologies are being developed to solve them.
Padraic MORRISSEY, Pilot Line Programme Manager, TYNDALL NATIONAL INSTITUTE

10:00 AM – Hybrid Photonic Integration for Communication, Quantum, and Sensing
Hybrid Photonic Integration allows for combining the best material for each optical function. Challenges in assembly and packaging are solvable. 
Martin SCHELL, Executive Director, FRAUNHOFER HEINRICH HERTZ INSTITUTE

10:30 AM – Quantum Enabling Photonic Packaging
Quantum enabling photonic component packaging requirements often diverge from those of traditional semiconductor packaging. What explore the solutions.
Andrew ROBERTSON, CTO, BAY PHOTONICS

11:00 AM – Coffee Break

11:15 AM Micro Transfer Printing for Compound Semiconductor 3DHI Microsystems
Micro transfer printing enables disruptive 3-dimensional compound semiconductor and silicon heterogeneous integration for photonics, power and RF applications.
Bob CONNER, VP New Application Business Development, X-Celeprint  

11:45 AM High accuracy placement for Photonics and RF applications
High accuracy placement is the key for Photonics and RF packaging in the next decade and beyond.
Daniel LIESKE, Senior Expert Advanced Packaging, AEMtec

12:15 – Lunch Break

RF SESSION
1:30 PM New JSR Packaging materials for 5G and RF applications
High density routing and low loss design are the key for future advanced Packaging
Jérôme SERRAND, Technical Packaging Manager, JSR

2:00 PM Making mm-Wave and sub-THz Over-the-Air Characterization a Reality
For highly integrated mm-Wave devices, we need the right set of complementary tools and techniques to ensure a smooth path from design to validation.
Sander BRONCKERS, Assistant professor // Co-founder, ANTENNEX
Ad REINERS, Education and research // Co-founder, ANTENNEX


2:30 PM RF SIP packaging markets trends
Gabriela  PEREIRA, Technology & Market Analyst, Yole Intelligence part of Yole Group

3:00 PM – Coffee Break

POWER SESSION
3:15 PM Packaging and integration of advanced power semiconductors
Methods, materials, and technologies to overcome the EMI, thermal, and insulation limitations of wide- and ultra-wide-bandgap power semiconductors.
Christina DIMARINO, Assistant Professor, VIRGINIA TECH

3:45 PM Accelerating SiC power electronics commercialization
The key aspects of SiC technology and outline efforts to overcome the last major barriers to mass commercialization.
Victor VELIADIS, Executie Director & CTO, POWER AMERICA

4:15 PM Reverse Technology and Cost for Power Devices Packaging
Technology and Cost Overview Of Power Packaging for Discretes and Modules
Amine ALLOUCHE Technology & Cost Analyst Yole SystemPlus

4:45 PM Conclusion

Event price:

Online registration: FREE
It includes: online conference and proceedings

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