SST Webcast – Advanced Packaging: A Changing Landscape Rife with Opportunities

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webcast AP SST YoleYole Développement will be pleased to give its vision of the Advanced Packaging market during the webcast “Advanced Packaging: A Changing Landscape Rife with Opportunities” organized by Solid State Technology, and to share the floor with the CEA Leti.

This webast will take place on may 10th, 6:00 PM (GMT) – REGISTER HERE

Webcast overview: In order to adapt to new applications and cut down cost, the semiconductor industry seeks further performance and functionality boosts through package level system integration. While transistor scaling options remain uncertain in the shorter term and continue to be investigated, the spotlight is turned to advanced packages. Emerging packages such as fan-out wafer level packages, 2.5D/3D IC solutions and related SiPs together with upgraded flip chip CSP/BGAs aim to bridge the gap and revive the cost/performance curve while at the same time adding more functionality.
This webcast will focus on the status of the advanced packaging industry, the challenges and opportunities that lie ahead. A high level overview will be given on current and future global markets, with a particular reflection on the evolution of the market in China. Furthermore, 3D integration packaging technology developments will be summarized, with focus on the 2.5D/3D, FO WLP and advanced FC substrate platforms.




AndrejIvankovic YOLE2015 Pro BD

Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing, Yole Developpment

Andrej Ivankovic is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement. He holds a master’s degree in Electrical Engineering, with specialization in Industrial Electronics from the University of Zagreb, Croatia and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started as an intern at ON Semiconductor performing reliability tests, failure analysis and characterization of power electronics and packages. The following 4 years he worked as a R&D engineer at IMEC Belgium on the development of 3D IC technology, focusing on electrical and thermo-mechanical issues of 3D stacking and packaging. Part of this time he also worked at GLOBALFOUNDRIES as an external researcher. He has regularly presented at international conferences authoring and co-authoring 18 papers and 1 patent.


Mike Kelly

Mike Kelly, Senior Director 3D TSV Development, Amkor Technology

Mr. Kelly joined Amkor in 2005 and has led package developments for EMC shielding, low cost thermal enhancements for PBGAs, image sensors and most recently 2.5D and SLIM package development. He previously worked for HP and Avago. Mike has worked in electronics interconnect for 24 years, including circuit board assembly, IC package mechanical and thermal design and projects ranging from polyester flexible circuits to eutectic flip chip, and management of IC IP block design and acquisition and electrical signal integrity teams. Mike holds master’s degrees in Mechanical and Chemical Engineering.

Sponsored by Brewer Science

Contact: https://www.webcaster4.com/Webcast/Page/721/14598

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