Trends and Challenges in Semiconductor Advanced Packaging – WebinarRegister now
Yole Développement invites you to attend this webinar organized by SIA (Semiconductor Industry Association).
The global semiconductor industry increasingly relies on innovations in chip packaging to achieve the economic gains that have historically been achieved though silicon scaling in the front end semiconductor fabrication process. Many packaging technologies exist today, and selecting the correct one is no longer an afterthought but an integral part of the semiconductor manufacturing process to help ensure commercial success. For semiconductor firms that specialize in the “backend” assembly, test, and packaging of semiconductors, also known as OSATs, the current environment pose both unique challenges and opportunities.
Please join a panel of industry experts for a conversation about the current trends and challenges in advanced packaging for semiconductors. Panelists include Santosh Kumar, Director & Principal Analyst in the Semiconductor & Software division at Yole Développement; Guillaume Assogba, PhD, Economist at Yole Développement; John Stone, Executive Vice President and Chief Sales Officer Worldwide Sales & Marketing at Amkor Technology, Inc.; and Falan Yinug, Director of Industry Statistics and Economic Policy at the Semiconductor Industry Association.