CXL is reshaping the landscape of memory innovation
To get the pdf presentation & video replay, please contact us events@yolegroup.com
Without doubt, CXL has the potential to revolutionize memory utilization, management, and access in terms of disaggregation and composability. This paradigm change, which already occurred in the 90s for storage, gives birth to a new industry focused on CXL memory fabric software, systems, and services.
At Yole Group, analysts announce a US$14 million CXL market by 2023, with primarily prototypes only.
This figure should reach about US$16 billion by 2028.
With this cutting-edge innovation, we’re thrilled to extend this exclusive invitation to all professionals and enthusiasts in the semiconductor field.
For one hour, we invite you to discover the status of CXL technology and its underlying ecosystem and related business opportunities. This program welcomes Rambus, a leading CXL memory company, to deliver its vision of the industry and highlight CXL technology’s assets.
Our webcast promises to unveil leading-edge insights and discuss emerging market and technology trends. This event by Yole Group provides a dedicated opportunity for networking with industry memory experts.
Today, CXL is in its very early stages of deployment, with the first server CPUs supporting the CXL 1.1 interface – Intel’s Sapphire Rapids and AMD’s Genoa – entering mass production in early 2023.
A significant rise in the market will be seen once the first CXL 2.0 CPUs enter the market. Expected in the second half of 2024, they will enable the implementation of memory pools shared by many servers in the same rack. The ramp-up will be further reinforced with the availability of CXL 3.0 CPUs in late 2025. They are expected to enable memory pooling between racks as well as full disaggregation and composability of accelerators (GPUs, DPUs, FPGAs…) and storage technologies using PCIe.
WEBINAR’S PROGRAM
- Yole Group’s introduction
Emilie Jolivet, Director, Semiconductor, Memory & Computing at Yole Intelligence, part of Yole Group
- CXL might just be the key to turn today’s server memory challenges into a $15 billion opportunity by 2028
Thibault Grossi, Senior Technology & Market analyst at Yole Intelligence, part of Yole Group
Data center workloads are becoming increasingly complex, requiring ever-increasing memory, a very expensive resource, forecasted to reach over 40% of the server value by 2025. CXL has emerged as the industry choice, aiming to enhance cache coherency, resource disaggregation, and composability in data centers, with memory as its main driver for development.
CXL has the potential to revolutionize memory utilization, management, and access in terms of disaggregation and composability. This is not just a technology but a paradigm shift that could give rise to a burgeoning market focusing on CXL memory fabric software, devices, systems, and services.
- CXL Technology: Revolutionizing the Data Center
Danny Moore, Marketing & Applications Director, CXL Processing Solutions team at Rambus
The need for more memory bandwidth and capacity continues to rise, with applications like generative AI pushing current data center infrastructure to the limit. The leading companies at every level of the data center value chain are coalescing around CXL technology as a path to revolutionize the data center. Join Danny Moore to hear how CXL promises tremendous gains in computing performance by bridging the latency gap between direct-attached DRAM main memory and solid-state storage, as well as enabling new tiered-memory solutions and composable architectures
- Q&A Session, moderated by Emilie Jolivet
Danny Moore
Director of marketing and applications for the CXL Processing Solutions team
Danny is a product management expert with over 25 years of industry experience focused primarily on the needs of the data center and cloud. Much of his career has been centered around PCIe, PCIe switching, PCIe fabrics, and fostering collaborations with CSPs to enhance the versatility and composability of compute, memory, and storage infrastructure. Danny is presently focused on driving industry engagement around memory and memory scaling while actively participating in key initiatives such as the CXL Consortium and the CXL Marketing Working Group. He also participates on the OCP Future Technologies Initiative AI Hardware Software Co-Design Collaboration Workstream where he co-authored, “Polymorphic Architectures for Future AI Applications,” which aims to directly impact Generative AI in the data center. At Rambus, Danny’s role centers on product planning to meet the needs of memory in the next generation of data centers, where he holds numerous patents. Danny also serves as the Chairperson for the JEDEC CXL Controller Package and IO Task Group.
Thibault Grossi
Senior Technology & Market Analyst, Memory
Thibault GrossiI is a Senior Technology & Market analyst, Memory at Yole Group.
Thibault is in engaged with in-depth analysis of the dynamic memory market, and is in charge of the Yole Group’s NAND market research.
Prior to Yole Group, he worked at Schneider Electric as resident engineer in an EMS in Asia and then occupied different position within the electronic procurement organization ( PCBA, Software and semiconductor).
Semiconductor business has been his focus for the last 10 years.
First in Projects Procurement and then as Category Manager for Semiconductor and Display where he was in charge of procurement strategy on memory and analog. He led global negociations and interfaced Europe designs projects.
Thibault obtained in 2006 a master degree in electronic and computing science from Pierre and Marie Curie University in Paris.
Emilie Jolivet
Business Line Director, More Moore activities
Emilie Jolivet is Business Line Director of the More Moore activities at Yole Group.
Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the memory, computing & software team.
In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside Yole Group.
Prior to Yole Group, after an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Then, Emilie worked at EV Group (Austria) as a business development manager in 3D & Advanced Packaging.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). She also graduated with an MBA from IAE Lyon.
Rambus makes industry-leading chips and IP that advance data center connectivity and solve the bottleneck between memory and processing.
The ongoing shift to the cloud, along with the widespread advancement of AI across data center, 5G, automotive and IoT, has led to an exponential growth in data usage and tremendous demands on data infrastructure. Creating fast and safe connections, both in and across systems, remains one of the most mission-critical design challenges limiting performance in advanced hardware.
Rambus is ideally positioned to address this challenge as an industry pioneer with over 30 years of advanced semiconductor interconnect experience moving and protecting data. We are a leader in high-performance memory subsystems, providing chips, IP and innovations that maximize the performance and security in data-intensive systems.
Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data transfer speed and trust. Rambus products and innovations deliver the increased bandwidth, capacity and security required to usher in a new era of data center architectures and drive ever-greater end-user experiences.
