Packaging technologies are expanding the boundaries of power and RF applicationsRegister now
Power and RF Packaging Virtual Forums
Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.
With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.
Save these dates in your agenda and let’s meet online on November 24, 2020 and December 1, 2020!
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