SYNAPS 2020 – On-Demand Conference

You have reached the On-Demand Conference section of SYNAPS.
You can click below on the title of the presentation to access the video. You can also find some of the proceedings (the password is the same than to access this webpage).

Please notice that only the pre-recorded presentations done by our online speakers will be available at this date. The presentations given by our onsite speakers and lively recorded will be available on the same link the week after.

This webpage will be available until October 30th, 2020.

More information available here.

9:10 AM – 9:30 AM
Low Cost Solution for 2.5D using Fan-Out Embedded Bridge – ONLINE
C. Key Chung, PhD – Senior Director of Advanced Package R&D – SPIL

9:30 AM – 9:50 AM
Reliability Issues in Advanced Packaging – ONLY ON-SITE
Hongwen He, Ph.D.– Responsible For Collaboration Plans With Colleges And Industry – HiSilicon

9:50 AM – 10:05 AM
Meeting the challenges of Large Panel, high density placement in Embedded Die SIP packaging – ONLINE
Sylvester Demmel – Senior Product Manager for SIPLACE Advanced Packaging – ASM Assembly Systems
PROCEEDING

10:05 AM – 10:20 AM
Panel level sputter tool for High Volume Manufacturing (HVM) – ONLINE
Ewald Strolz – Head of Process Development / BU Advanced Packaging – Evatec
PROCEEDING

10:50 AM – 11:10 AM
Overview of the Latest PVD Developments for High Density FOWLP – ONLINE
David Butler – EVP & General Manager – SPTS Technologies
PROCEEDING

11:10 AM – 11:30 AM
Advanced Packaging Substrate in NCAP – ON-SITE
Qidong Wang – Director of R&D Department – NCAP
PROCEEDING

11:30 AM – 11:50 AM
Advanced Assembly Technology for Memory Product – ON-SITE
Shen, Guoqiang – JSCC WB Group R&D Center And Engineering Team Manager – JCET
PROCEEDING

11:50 AM – 12:10 PM
Memory Packaging Technology – ON-SITE
Wade Liu – Technical marketing Director – Huatian Technology
PROCEEDING

1:10 PM – 1:35 PM
The future of wafer-level 3D IC technologies: Multiple wafer stacking (M-stacking) and Heterogeneous Integration (Hi-stacking) – ON-SITE
Dr. Holly Sun – COO & SENIOR VP – XMC

1:35 PM – 1:50 PM
Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration – ONLINE
Dr. Thomas Uhrmann – Director of business development – EV Group (EVG)
PROCEEDING

1:50 PM – 2:05 PM
Advancement in Bonding and Molding Technology for High End Devices – ONLINE
Ruurd Boomsma – Chief Technology Officer – Besi
PROCEEDING

2:05 PM – 2:25 PM
Heterogeneous Integration – ON-SITE
Wang Qiong An – Senior Manager Of Product Marketing Department – EA/APMR Business Unit – K&S

2:55 PM – 3:15 PM
Solving test and measurement challenges for 2.5D/3D heterogenous integration challenges – ONLINE
Kenan Görgülü – Head Of Global Sales – Frt Gmbh Germany A Formfactor Company & Amy Leong CMO, SCP M&A – Formfactor Inc
PROCEEDING

3:15 PM – 3:35 PM
Heterogeneous Integrations: Challenges and Solutions – ON-SITE
Percy Lam – Sales Manager – ASM Pacific Technology
PROCEEDING

3:35 PM – 3:50 PM
Inspection and Metrology Challenges for Advanced Packaging – ONLINE
Ramy Langer – Chief Operating Officer – Camtek
PROCEEDING

3:50 PM – 4:10 PM
Glass Carriers for Advanced Packaging Applications – ONLINE
Varun Singh – Product Line Manager, Carrier Solutions – Corning
PROCEEDING

4:10 PM – 4:30 PM
Development of 3D Wafer Level Packaging and Integration Technologies for 5G Applications – ON-SITE
Dr. Daquan Yu – CEO – Xiamen Sky Semiconductor
PROCEEDING

4:30 PM – 4:45 PM
Glass substrate trend for semiconductor devices and advanced packaging application – ONLINE
Santosh Kumar – Principal Analyst – Yole Développement
PROCEEDING