SYNAPS 2020 – On-Demand Conference

You have reached the On-Demand Conference section of SYNAPS.
You can click below on the title of the presentation to access the video. You can also find some of the proceedings (the password is the same than to access this webpage).

Please notice that only the pre-recorded presentations done by our online speakers will be available at this date. The presentations given by our onsite speakers and lively recorded will be available on the same link the week after.

This webpage will be available until October 30th, 2020.

More information available here.

9:10 AM – 10:20 AM: Embedded Technologies and system in Package Session – 1/2

9:10 AM – 9:30 AM
Low Cost Solution for 2.5D using Fan-Out Embedded Bridge – ONLINE

C. Key Chung, PhDSenior Director of Advanced Package R&D – SPIL

9:30 AM – 9:50 AM
Reliability Issues in Advanced Packaging – ONLY ON-SITE
Hongwen He, Ph.D.Responsible For Collaboration Plans With Colleges And Industry – HiSilicon

9:50 AM – 10:05 AM
Meeting the challenges of Large Panel, high density placement in Embedded Die SIP packaging – ONLINE
Sylvester DemmelSenior Product Manager for SIPLACE Advanced Packaging – ASM Assembly Systems

10:05 AM – 10:20 AM
Panel level sputter tool for High Volume Manufacturing (HVM) – ONLINE
Ewald StrolzHead of Process Development / BU Advanced Packaging – Evatec

10:50 AM – 11:30 AM: Embedded Technologies and System in Package Session – 2/2

10:50 AM – 11:10 AM
Overview of the Latest PVD Developments for High Density FOWLP – ONLINE
David ButlerEVP & General Manager – SPTS Technologies

11:10 AM – 11:30 AM
Advanced Packaging Substrate in NCAP – ON-SITE
Qidong WangDirector of R&D Department – NCAP

11:30 AM – 12:10 PM: Memory Packaging Session

11:30 AM – 11:50 AM
Advanced Assembly Technology for Memory Product – ON-SITE
Shen, GuoqiangJSCC WB Group R&D Center And Engineering Team Manager – JCET

11:50 AM – 12:10 PM
Memory Packaging Technology – ON-SITE
Wade LiuTechnical marketing Director – Huatian Technology

1:10 PM – 2:25 PM: High-End Packaging and 3D Session – 1/2

1:35 PM – 1:50 PM
Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration – ONLINE
Dr. Thomas UhrmannDirector of business development – EV Group (EVG)

1:50 PM – 2:05 PM
Advancement in Bonding and Molding Technology for High End Devices – ONLINE
Ruurd BoomsmaChief Technology Officer – Besi

2:05 PM – 2:25 PM
Heterogeneous Integration – ON-SITE
Wang Qiong AnSenior Manager Of Product Marketing Department – EA/APMR Business Unit – K&S

2:55 PM – 3:50 PM:  High-End Packaging and 3D Session – 2/2

2:55 PM – 3:15 PM
Solving test and measurement challenges for 2.5D/3D heterogenous integration challenges – ONLINE
Kenan GörgülüHead Of Global Sales – Frt Gmbh Germany A Formfactor Company & Amy Leong CMO, SCP M&A – Formfactor Inc

3:15 PM – 3:35 PM
Heterogeneous Integrations: Challenges and Solutions – ON-SITE
Percy LamSales Manager – ASM Pacific Technology

3:35 PM – 3:50 PM
Inspection and Metrology Challenges for Advanced Packaging – ONLINE
Ramy LangerChief Operating Officer – Camtek

3:50 PM – 4:45 PM: Glass Packaging Session

3:50 PM – 4:10 PM
Glass Carriers for Advanced Packaging Applications – ONLINE
Varun SinghProduct Line Manager, Carrier Solutions – Corning

4:30 PM – 4:45 PM
Glass substrate trend for semiconductor devices and advanced packaging application – ONLINE
Santosh KumarPrincipal Analyst – Yole Développement