Advanced Packaging: game-changer for semiconductor revolution

Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, AI & HPC… The market today is dominated by large IDMs , such as Intel and Samsung, top 4 global OSATs and foundry with packaging house – TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, Fan-Out packaging, 3D TSV] and more… to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.

A few years ago, Yole Développement (Yole) and NCAP China decided to create a unique place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities. Today, both partners confirm their success with the 5th Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry.

With unique access to leading players and experts, the Advanced Packaging & System Integration Technology Symposium will take place in Shanghai at the end of the month and presents 5 key industry focuses: AI & HPC, memory & computing, transportation, 5G and consumer. The Organizing Committee is offering about 20 inspiring presentations, 2 market briefings and several networking times to cover a broad range of topics…

Make sure you are part of the 2019 Symposium and register right now on!

In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB, RF, and PMU. But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, the market value increased 4x by 2018. Thus, the HD] Fan-Out market segment was created, reducing the market-share ratio of OSATs…. More info.

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