Discrete power device packaging, a big and slow-growing market

The discrete power devices market represents almost US$13.5 billion in 2018 with a 2.9% CAGR between 2018 and 2024. This industry is clearly well established and mature, confirms Yole Développement (Yole).Therefore, the discrete power device market is following the global rise of the power electronic industry.

In parallel, Yole’s analysts announce a US$3.7 billion market only for the packaging part, with a 1.1% CAGR during the same period. “The discrete power device packaging industry still offers business opportunities, especially for materials suppliers and packaging companies”, comments Milan Rosina, PhD. Principal Analyst, Power Electronics & Batteries, at Yole.

Yole Group of companies including Yole Développement and System Plus Consulting proposes today a complete view of the discrete power devices packaging industry with two dedicated reports, Discrete Power Device Packaging: Materials Market and Technology Trends and Power Discrete Packaging Comparison. Both companies combine their expertise to perform valuable and comprehensive analyses of the current packaging solutions taking into account the status of the power electronics industry. Discover today the status of the packaging technologies for discrete power devices.

Amongst the discrete power device industry’s key characteristics and needs are low cost per device, a large selection of products and suppliers, and use of proven, highly standardized products and technologies, including packaging technologies.

“In fact, packaging technologies for discrete power devices including lead frame, die attach, electrical interconnections, and encapsulation should have the aforementioned characteristics,” explains Shalu Agarwal, PhD. Technology & Market Analyst, Power Electronics & Materials at Yole. “It is difficult to match the high volume, standardized products and low cost required by device integrators with the acceptable additional costs equated to innovative packaging technologies”.

Under this context, the combination of market growth and market size for different packaging solutions gives the complex result with many different variables, including device demand evolution, die size, package type and interconnection method used, device size following downsizing trends, semiconductor content per packaged device, and more. Some of these factors favor a market increase, others a market decrease, participating in a rather flat market evolution. As a consequence, the discrete power packaging market’s evolution remains pretty flat but is still growing grow between 2018 and 2024… More info.

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