WLCSP / Fan-In has been selected by Apple for its latest iPhones
“WLCSP / Fan-In packages are here to stay as they offer “best in class” solution for mobile applications,”asserts Vaibhav Trivedi, Senior Technology & Market analyst, Advanced Packaging at Yole Développement (Yole). “WLCSP / Fan-In solutions are increasing scalability and offering best cost with reliable performance.”
Generally speaking, the global WLP market was worth US$3.3 Billion in 2019 and is expected to grow at an 8.9% CAGR to reach US$5.5 Billion by 2025. WLCSP / Fan-In was worth more than US$2 Billion in 2019 and is expected to grow at a CAGR of 3.2% to exceed US$2.5 Billion by 2025…
Yole, the market research and strategy consulting company, and its partner, System Plus Consulting, research the advanced packaging industry all year long. Thanks to daily exchanges with leading advanced packaging companies, analysts develop an extensive expertise in the technology evolution and market trends. This knowledge is delivered through an impressive collection of technical and market reports and monitors. The WLCSP / Fan-In Packaging Technologies and Market 2020 report is part of this compilation. Released today, it delivers a comprehensive overview of the WLCSP / Fan-In packaging market with detailed market figures and competitive landscape, together with an accurate analysis of the supply chain and business models. It also offers a relevant vision of the packaging technologies with their applications. Yole’s analysts follow the WLCSP industry, amongst many other advanced packaging platforms, and report back on a quarterly basis with its Advanced Quarterly Packaging Market Monitor. The advanced packaging monitor analyzes the WLP market’s evolution in terms of revenue, shipments, capex, market pricing, capacity, application & process technology mix, as well as supplier market shares. More information is supplied on i-Micronews. And, in the future, the company will extend its coverage to Flip Chip packaging and 2.5D/3D packaging.
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