Technology, Process and Cost
Advanced Packaging in AMD Radeon RX 7900 XTX
By Yole SystemPlus —
AMD Radeon RX 7900 XTX using TSMC Integrated Fan Out On Substrate Process.
SPR24812
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
- AMD
Physical Analysis
- Summary of the physical analysis
- Module Disassembly
- Package Analysis (Overview, Opening X-Ray, Cross Section)
- Die Analysis (GPU, MCD)
Manufacturing Process Flow Analysis
- Global Overview
- Die Front-End & Wafer Fabrication Unit
- Packaging process
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- GPU Die Front-End Wafer Cost
- MCD Memory Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
Feedbacks
Related Products
About Yole Group
AMD Radeon RX 7900 XTX using InFo OS Process
AMD debut the 3rd generation RDNA graphics architecture, or RDNA3.
With it, the company is also introducing the world's first chiplet-based GPU in an effort to maximize utilization of the TSMC 5 nm foundry node, without compromising on performance, or too much on power.
The new architecture improves in many areas, including compute power, memory sub-system, display engine with support for the latest DisplayPort 2.1 standard, multiple-stream acceleration for the latest video formats, and most importantly, AI acceleration, and a more advanced ray tracing hardware.
To reveal all the details of the AMD Radeon RX 7900 XTX, this report features multiple analyses. One is a front-end construction analysis to study the key features of the chiplet integration, TSMC’s 5nm lithography processor and MCD. A back-end construction analysis reveals the packaging structure. Moreover, this report includes a detailed study of the die cross-sections. In addition to a complete analysis by using Scanning Electron Microscopy (SEM) cross-sections, material analyses, and delayering, we show Coherent Tomography (CT) 3D X-ray scans to reveal the layout of the chips in the package. Furthermore, the report includes a description of the assembly process. Lastly, this report furnishes a complete cost analysis and a selling price estimation of AMD’s Radeon RX 7900 XTX processor.
- AMD
- TSMC
Key Features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Cost Analysis
What's new?
- AMD debuts the 3rd generation RDNA graphics architecture, known as RDNA3. Along with it, the company is also introducing the world's first chiplet-based GPU in an effort to maximize utilization of the TSMC 5 nm foundry node, without compromising on performance or power consumption.