Technology, Process and Cost

AMD 3D V-Cache with TSMC SoIC 3D Packaging

By Yole SystemPlus

AMD Ryzen 7 gaming CPU uses heterogeneous integration 3D packaging, including hybrid bonding technology.

KEY FEATURES:

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Industry’s first 3D V-Cache compute die bonded with cache memory
  • System-on-Chip (SoC) with multiple dies and different foundries
  • TSMC System on Integrated Chips (SoIC) technology
  • Hybrid bonding technology
  • High density Through Silicon Vias (TSVs)

 

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