Technology, Process and Cost
ams’ dToF laser autofocus in the Honor Magic3 Pro
By Yole SystemPlus —
ams’ multi-zone direct-time-of-flight depth ranger TMF8821, with SPAD ASIC and wafer-level optic technology.
- Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- dToF Depth Ranging
- TMF8821 Overview & Specs
- Glossary
- Company Profile
- Physical Analysis
- Summary of the Physical Analysis
- Honor Magic3 Pro Teardown
- TMF8821 Module
- Module View & Teardown
- Module Cross Section
- SPAD ASIC Die
- SPAD ASIC Die Views & Dimensions
- SPAD ASIC Die Delayering
- SPAD ASIC Die Cross Section
- SPAD ASIC Die Process Summary
- VCSEL Die
- VCSEL Die View & Dimensions
- VCSEL Die Cross Section
- VCSEL Die Process Summary
- Physical Comparison (w/ VL53L5)
- Overview
- VCSEL
- Emission Optics
- Reception Optics
- SPAD ASIC
- Manufacturing Process Flow
- SPAD ASIC Die Fabrication Unit
- SPAD ASIC Die Front-End and Back-End Processes
- VCSEL Die Fabrication Unit
- VCSEL Die Front-End & Back-End Processes
- Package Fabrication Unit
- Package Manufacturing Processes
- Final Test & Dicing
- Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- SPAD ASIC Die
- SPAD ASIC Die Circuit Front-End Costs
- SPAD ASIC Die Optical & Gold Layers Costs
- SPAD ASIC Die Total Front-End Costs
- SPAD ASIC Die Probe Test, Thinning & Dicing
- SPAD ASIC Die Cost
- VCSEL Die
- VCSEL Die Front-End Costs
- VCSEL Die Front-End Step Costs
- VCSEL Die Probe Test, Thinning & Dicing
- VCSEL Die Cost
- Wafer-Level Optic Diffuser Die
- Package Manufacturing
- Package Panel, BOM & Manuf. Costs
- Package Panel Manuf. Step Costs
- Completed Module Cost and Breakdown
- Selling Price
- Feedback
- Related Products
- About Yole Group
PRODUCT'S KEY FEATURES:
- Detailed photos
- Detailed SEM images
- Teardown
- Cross-sectional analysis
- Delayering analysis
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Physical comparison with STMicroelectronics’ VL53L5