Technology, Process and Cost
Apple iPad Pro LiDAR Module
By Yole SystemPlus —
The first 3D direct Time-of-Flight (dToF) CMOS image sensor from Sony with dedicated Lumentum VCSEL.
Overview/Introduction
Company Profile
Market Analysis
Physical Analysis
- LiDAR Module Assembly
- Module views, opening and cross-section
- NIR CIS and VCSEL lenses
- NIR CIS Die
- Die overview and dimensions, process, cross-section and process characteristic
- NIR VCSEL Die
- Die view and dimensions, cross-section and process characteristic
- DOE
- DOE dimensions, disassembly and main block identification, cross section and process characteristics
- VCSEL Driver Die
- Die view, dimensions and processes
- Delayering and main blocks
Manufacturing Process Flow
- Global Overview
- Front-End Process and Fabrication Unit of NIR Sensor Die, NIR VCSEL, DOE Wafer and VCSEL Driver
Cost Analysis
- NIR CIS Sensor, VCSEL, DOE and VCSEL Driver Component
- LIDAR Module Cost
Cost Analysis
- Cost Analysis Overview
- Yield Hypotheses
- Sensor Die Cost
- Front-end cost
- Optical back-end cost and cost per process step
- Back-end: Tests and dicing
- Wafer and die cost
- Module Cost
Technical and Cost Comparison
- Ipad Pro Vs. LG G8 vs. Vivo Nex Dual Display
Following the first introduction of a 3D sensing module for Face ID in the front side of the iPhone X, Apple is now releasing the new iPad Pro with a rear LiDAR scanner. This rear 3D sensing module is using the first ever consumer direct Time-of-Flight (dToF) CMOS Image Sensor (CIS) product with in-pixel connection. It supports Apple’s ARkit 3.5 development kit for augmented reality.
This full reverse costing study has been conducted to provide insights into technology data, the manufacturing cost and selling price of the rear LiDAR scanner in the iPad Pro.
The 3D sensing module includes a new generation of Near Infrared (NIR) CIS from Sony with a Single Photon Avalanche Diode (SPAD) array. The sensor features 10 µm long pixels and a resolution of 30 kilopixels. The in-pixel connection is realized between the NIR CIS and the logic wafer using hybrid Direct Bonding Interconnect technology, which is the first time Sony has used 3D stacking for its ToF sensors.
The LiDAR uses a vertical cavity surface emitting laser (VCSEL) coming from Lumentum. The laser is designed to have multiple electrodes connected separately to the emitter array. A new design with mesa contact is used to enhance wafer probe testing.
A wafer level chip scale packaging (WLCSP), five-side molded driver integrated circuit from Texas Instruments generates the pulse and drives the VCSEL power and beam shape. Finally, a new Diffractive Optical Element (DOE) from Himax is assembled on top of the VCSEL to generate a dot pattern.
Along with the complete technical analysis of the 3D depth sensing system, this report analyses the cost and estimates the price for the system. It also includes a technical and cost comparison with the rear 3D sensing system in the LG G8 ThinQ and the Vivo Nex dual display.
Reverse costing with:
- Analysis of the LiDAR module structure, including SPAD NIR CIS, VCSEL, DOE and module
- Detailed optical and SEM photos
- Precise measurements
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology comparisons between the Apple iPad Pro, the LG G8 and the Vivo NEX dual display